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10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board

10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board

    • 10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board
    • 10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board
    • 10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board
    • 10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board
    • 10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board
    • 10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board
    • 10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board
  • 10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S06E4691A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 20pcs/bag, 20bags/carton
    Delivery Time: 20 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
    Contact Now
    Detailed Product Description
    Material: FR4 , EM-370 Board Thickness: 1.6MM
    Layer Count: 6 Layer Solder Mask: Green
    Surface Treatment: ENIG Silkscreen: White
    High Light:

    6 Layer HDI PCB Board

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    1.6MM HDI PCB Board

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    10Mil BGA HDI PCB Board

     

    6 Layer Printed Circuit Board With Blind And Buried Holes

     

     

    PCB Specifications:

     

    Layer Count: 6Layer HDI PCB

    Board Thickness: 1.6MM

    Material: FR4 EM-370 EM-370(D) Datasheet 20171121_18061416999.pdf

    Holes: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM

    Min Line: 3/5 Mil

    BGA Size: 10Mil

    Unit Size: 160MM*150MM/1UP

    Blind Holes: L1-L2 , L5-L6 0.1MM

    Buried Holes: L2-L5 0.2MM

    Solder Mask: Green

    Surface Treatment: ENIG

    Application: Industrial Control

     

     

     

    Our Manufacturing Capabilities:

     

    NO Item Capability
    1 Layer Count 1-24 Layers
    2 Board Thickness 0.1mm-6.0mm
    3 Finished Board Max Size 700mm*800mm
    4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    5 Warp <0.7%
    6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
    7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
    8 Drill Hole Diameter 0.1mm-6.5mm
    9 Out Layer Copper Thickness 1/2OZ-8OZ
    10 Inner Layer Copper Thickness 1/3OZ-6OZ
    11 Aspect Ratio 10:1
    12 PTH Hole Tolerance +/-3mil
    13 NPTH Hole Tolerance +/-1mil
    14 Copper Thickness of PTH Wall >10mil(25um)
    15 Line Width And Space 2/2mil
    16 Min Solder Mask Bridge 2.5mil
    17 Solder Mask Alignment Tolerance +/-2mil
    18 Dimension Tolerance +/-4mil
    19 Max Gold Thickness 200u'(0.2mil)
    20 Thermal Shock 288℃, 10s, 3 times
    21 Impedance Control +/-10%
    22 Test Capability PAD Size min 0.1mm
    23 Min BGA 7mil
    24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc


     

     

    FAQ:

     

    Question: What is PCB High voltage testing or High Potential (HiPot) Testing? Why is it done?

    Answer: The High Potential (HiPot) test is conducted to check whether the dielectric material of a PCB board can withstand a voltage higher than its rated voltage without breaking down. This is a type of stress test helps measure the dielectric strength of the PCB substrate which in turn helps to measure the insulation capability of the Device Under Test (DUT). It also gives an idea to how much voltage the DUT can withstand during real-life applications.

     

    In this test, a high voltage is supplied to the PCB board for a few seconds to check for the insulation or dielectric strength of the components mounted on the PCB board. The duration of the HoPot test can vary from a few seconds to up to a few minuets. The IEC 60950 standard says the test must be conducted for 1 minute. A board is subjected to the HiPot test only after conducting fault detection, humidity, and vibration tests.

    Both AC and DC can be used to carry out HiPot Test. This can depend on the requirements established by the regulatory testing agency. However it is best to test an AC Powered device with a high AC Voltage and a DC powered device with a high DC voltage.

     

    How to calculate HiPot test voltage?

     

    There is no exact way to calculate the HiPot voltage, however a general rule of thumb would be (2 x Nominal input voltage) + 1000 V. For an instance, if the operating input voltage is 140 Volts then the HiPot Voltage would be (140 x 2) V + 1000 V = 1280 V or 1.28 KV.

     

    How is a HiPot Test performed?

    This test can be performed by applying a high voltage to the Printed Circuit Board or Device in which the PCB is used and monitoring the resulting leakage current. The voltage that is applied in a HiPot Test can be up to 10 times higher than the rated voltage of the PCB. The voltage is applied between the main input and the chassis (outer framework) of the product.

    10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board 0

    In the above figure, we have considered a basic circuit to demonstrate the condition of HiPot test

     

    HiPot Test Pass Condition:

     

    If the substrate of the PCB can resist the high voltage without breaking down and also inhibits the flow of leakage current then it can be seen as a HiPot pass condition.

    10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board 1

    Good insulation will not allow the flow of excess leakage current on the surface of the device.

     

    HiPot Test Fail Condition:

     

    If the breakdown occurs and there is no control on the leakage current then it can be considered as a HiPot fail condition.

    10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board 2

    Poor insulation can cause the flow of excess leakage current on the surface of the device under test.

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)