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16Mil BGA Automobile Fr4 10 Layer HDI PCB Board

16Mil BGA Automobile Fr4 10 Layer HDI PCB Board

    • 16Mil BGA Automobile Fr4 10 Layer HDI PCB Board
    • 16Mil BGA Automobile Fr4 10 Layer HDI PCB Board
    • 16Mil BGA Automobile Fr4 10 Layer HDI PCB Board
    • 16Mil BGA Automobile Fr4 10 Layer HDI PCB Board
    • 16Mil BGA Automobile Fr4 10 Layer HDI PCB Board
    • 16Mil BGA Automobile Fr4 10 Layer HDI PCB Board
    • 16Mil BGA Automobile Fr4 10 Layer HDI PCB Board
    • 16Mil BGA Automobile Fr4 10 Layer HDI PCB Board
  • 16Mil BGA Automobile Fr4 10 Layer HDI PCB Board

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S10E4724A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 20pcs/bag, 20bags/carton
    Delivery Time: 25 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
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    Detailed Product Description
    Material: FR4, TG170 Board Thickness: 1.8MM
    Min Trace: 5/4Mil Solder Mask: Green
    BGA: 16 Mil Min Hole: 0.1MM
    Surface Treatment: Immersion Gold Application: Automobile Control Board
    High Light:

    10 Layer Fr4 Circuit Board

    ,

    Automobile HDI PCB Board

    ,

    16Mil BGA Fr4 Pcb Board

    10 Layer HDI Printed Circuit Board , Automobile PCB  , Green Solder Mask , ENIG

     

    PCB Specifications:

     

    Layer Count: 10 Layer HDI PCB

    Board Thickness: 1.8MM

    Material: FR4 High Tg

    Min Hole: 0.1MM

    Min Line: 5/4 Mil

    BGA: 16Mil

    Hole: L1-L2, L2-L3, L2-L9, L8-L9, L9-L10, L1-L10 0.2MM

    Solder Mask: Green

    Surface Treatment: Immersion Gold

    Application: Automobile Control Board

     

     

    Capabilities:

     

    Item Capability
    Layer Count 1-24 Layers
    Board Thickness 0.1mm-6.0mm
    Finished Board Max Size 700mm* 800mm
    Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    Warp <0.7%
    Major CCL Brand KB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material Type FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter 0.1mm-6.5mm
    Out Layer Copper Thickness 1/20Z-8OZ ;
    Inner Layer Copper Thickness 1/3OZ-6OZ
    Aspect Ratio 10:1
    PTH Hole Tolerance +/-3mil
    NPTH Hole Tolerance +/-1mil
    Copper Thickness Of PTH Wall >10mil(25um)
    Line Width And Space 2/2mil
    Min Solder Mask Bridge 2.5mil
    Solder Mask Alignment Tolerance +/-2mil
    Dimension Tolerance +/-4mil
    Max Gold Thickness 200u'(0.2mil)
    Thermal Shock 288C, 10s, 3 Times
    Impedance Contro +/-10%
    LTest Capability PAD Size Min 0.1mm
    Min BGA 7mil
    Surface Treatment OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable

     

     

     

    FAQ:

     

    Questions:What is Solder Paste?

    Answer:

    16Mil BGA Automobile Fr4 10 Layer HDI PCB Board 0

    Solder Paste is a form of solder than can be easily applied on a Printed Circuit Board. It has a viscous state and is grey in color. The paste consists of a combination of tiny balls of solder and flux mixed together to form a paste. It is applied to the pads on a PCB where electronic components need to be placed. When heated this paste melts to form a connection between the pads and the leads of electronic components placed on the PCB.

    Solder paste is used during the PCB assembly process. The paste is applied on the PCB Board using a solder paste printer, in a process similar to screen printing i.e a stencil is placed over the PCB and then the solder is applied over the board using a solder paste printer. The components are then placed on the board. The viscosity of the paste helps keeps the components in place as the board is moved around or as the board is passed from the component placement section to the reflow oven using a conveyor belt. Once in the reflow oven, based on the thermal provide of the solder paste it melts and when cooled resulted in a soldered connection between the pads on the PCB and the leads of the electronic component.

    16Mil BGA Automobile Fr4 10 Layer HDI PCB Board 1

    Solder Paste is usually used for soldering Surface Mount Components on a PCB, however, this can also be used to solder thru-hole components by applying this paste using a brush or via an injection.

    Solder Paste Storage

    Solder paste should be stored in an airtight container to prevent oxidation and should be stored at low temperatures (but should not lower than freezing temperature) to prevent the flux degradation.

    Composition of solder paste:

    Solder paste is the mixture of tiny solder balls and solder flux. Depending upon the application, the solder ball's composition will vary. The Solder paste is mixed using solder paste mixers.

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)