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1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board

1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board

    • 1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board
    • 1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board
    • 1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board
    • 1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board
    • 1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board
    • 1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board
  • 1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S04O4669A0

    Payment & Shipping Terms:

    Minimum Order Quantity: Negotiable
    Price: Negotiable
    Packaging Details: 20pcs/bag, 10bags/carton
    Delivery Time: 15 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
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    Detailed Product Description
    Board Thickness: 1.6MM Material: FR4, TG150
    Min Hole: 0.3MM Copper Thickness: 1/1/1/1OZ
    Solder Mask: Blue Surface Treatment: OSP
    Min Trace: 6/6Mil
    High Light:

    FR4 Printed Circuit Board

    ,

    OSP 4 Layer PCB Board

    ,

    1.6MM Printed Circuit Board

    4 Layer Blue Solder Mask FR4 Printed Circuit Board
     
    PCB Specifications:

     
    Layer Count: 4 Layer  PCB
    Material: FR4, TG150
    Board Thickness: 1.6MM
    Min Hole: 0.3MM
    Hole Stucture: L1-L4
    Min Trace: 6/6Mil
    Unit Size: 175MM*164MM
    Solder Mas:Blue
    Surface Treatment: OSP
    Application: Speaker
     

     

    Capabilities:

     

    NO Item Capability
    1 Layer Count 1-24 Layers
    2 Board Thickness 0.1mm-6.0mm
    3 Finished Board Max Size 700mm*800mm
    4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    5 Warp <0.7%
    6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
    7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
    8 Drill Hole Diameter 0.1mm-6.5mm
    9 Out Layer Copper Thickness 1/2OZ-8OZ
    10 Inner Layer Copper Thickness 1/3OZ-6OZ
    11 Aspect Ratio 10:1
    12 PTH Hole Tolerance +/-3mil
    13 NPTH Hole Tolerance +/-1mil
    14 Copper Thickness of PTH Wall >10mil(25um)
    15 Line Width And Space 2/2mil
    16 Min Solder Mask Bridge 2.5mil
    17 Solder Mask Alignment Tolerance +/-2mil
    18 Dimension Tolerance +/-4mil
    19 Max Gold Thickness 200u'(0.2mil)
    20 Thermal Shock 288℃, 10s, 3 times
    21 Impedance Control +/-10%
    22 Test Capability PAD Size min 0.1mm
    23 Min BGA 7mil
    24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

     
     
     
    FAQ:
     
    Quesion: What is Organic Solderability Preservative (OSP) or Anti-Tarnish Surface Finish?
    Answer: The overall functionality of a PCB board depends upon the conductivity of copper tracks. These tracks tend to oxidize when exposed to the atmosphere, which creates a problem when soldering components on the board. Organic Solderability Preservative (OSP) regulates two things; temporary protection of exposed copper from being oxidized and improving the solderability before component fixation (assembly).
    OSP is a very thin (100-4000 Angstroms) organic coating on the PCB board, which is a water-based chemical compound of the ‘Azole family’ such as benzotriazoles, imidazoles, and benzimidazoles. This compound gets absorbed by the exposed copper and generates a protected film.
    Advantages of Organic Solderability Preservative:

    • Low cost
    • Environment-friendly
    • Re-workable, but can’t take more than 2-5 rounds of reflow soldering before degradation
    • It is lead-free and can handle SMT components easily
    • Provides a coplanar surface, well suited for tight-pitch pads (BGA, QFP).

    1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board 0
    Disadvantages of Organic Solderability Preservative:

    • Not Good for PTH (Plated Through Holes)
    • Short Shelf Life, less than 6 month
    • Inspection is difficult as it is transparent and colorless
    • requires careful handling, as it’s susceptible to mechanical damage

    OSP Surface Finishing Process:
    The OSP finishing process is composed of three major steps that include pre-cleaning and making the PCB board ready to apply a smooth OSP coating:

    1. Clean: Organic contaminants such as oil, fingerprints, oxidation film etc. are removed to get a clean PCB board.
    2. Topography Enhancement: To improve the bonding forces between exposed copper and OSP film, micro-etching is performed to minimize the oxidation generated on copper.
    3. Deionization Rinse: Before the final OSP application, the OSP solution is populated by ions so that it can be eliminated easily during soldering.

    1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board 1
     
     
     
     

     

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)