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4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes

4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes

    • 4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes
    • 4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes
    • 4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes
    • 4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes
    • 4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes
    • 4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes
  • 4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S04E3691A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 320pcs/bag , 20bags/carton
    Delivery Time: 20 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
    Contact Now
    Detailed Product Description
    PCB Type: HDI And Half Hole Layer Count: 4 Layer
    Blind Hole: L1-L2, L3-L4 0.1MM Buried Hole: L2-L3 0.2MM
    Finished Thickness: 0.8MM Material: FR4
    High Light:

    bluetooth pcb board

    ,

    printed circuit board fabrication

    4 Layer Half Hole Printed Circuit Board , Finished Thickness 0.8MM , HDI , Blind And Buried Holes

     

    4 Layer Half Hole Printed Circuit Board With Blind And Buried Holes

     

     

    PCB Specifications:

     

    Layer Count: 4Layer Half Plated Hole PCB

    Board Thickness: 0.8MM

    Copper Thickness: 1/H/H/1OZ

    BGA Size: 10 Mil, Via In Pad

    Min Hole: 0.1MM

    Min Line: 3/3 Mil

    Hole: L1-L4

    Blind Hole: L1-L2 0.1MM, L3-L4 0.1MM

    Buried Hole: L3-L4 0.2MM

    Solder Mask: Green

    Surface Treatment: ENIG

    Material: FR4

    Unit Size: 84*92MM/4*4up

    Special Treatment: 4 Side Half Plated Holes

    Application: WIFI Module

     

     

    Capabilities:

     

    Item Capability
    Layer Count 1-24 Layers
    Board Thickness 0.1mm-6.0mm
    Finished Board Max Size 700mm* 800mm
    Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    Warp <0.7%
    Major CCL Brand KB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material Type FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter 0.1mm-6.5mm
    Out Layer Copper Thickness 1/20Z-8OZ ;
    Inner Layer Copper Thickness 1/3OZ-6OZ
    Aspect Ratio 10:1
    PTH Hole Tolerance +/-3mil
    NPTH Hole Tolerance +/-1mil
    Copper Thickness Of PTH Wall >10mil(25um)
    Line Width And Space 2/2mil
    Min Solder Mask Bridge 2.5mil
    Solder Mask Alignment Tolerance +/-2mil
    Dimension Tolerance +/-4mil
    Max Gold Thickness 200u'(0.2mil)
    Thermal Shock 288C, 10s, 3 Times
    Impedance Contro +/-10%
    LTest Capability PAD Size Min 0.1mm
    Min BGA 7mil
    Surface Treatment OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable


     

    FAQ:

     

    Question: What is the most common quality issue for this kinf of pcb?

    Answer: 1) Copper burr in half holes

                  2) Oxidation in half holes

     

     

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)