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4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG

4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG

    • 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG
    • 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG
    • 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG
    • 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG
    • 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG
    • 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG
  • 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S04E3698A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 400pcs/bag, 20bags/carton
    Delivery Time: 25 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
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    Detailed Product Description
    Blind Hole: L2-L3 0.2MM Buried Hole: L1-L2 0.1MM , L3-L4 0.1MM
    Layer Count: 4 Layer Material: FR4
    Surface Treatment: OSP+Immersion Gold Solder Mask: Green
    High Light:

    electronic pcb board

    ,

    copper clad pcb board

    4 Layer Printed Circuit Board With Blind And Buried Holes , Half Hole PCB , OSP+ENIG

     

    4 Layer Printed Circuit Board With Blind And Buried Holes

     

     

    PCB Specifications:

     

    Layer Count: 4Layer Half Plated Hole PCB

    Board Thickness: 1.0MM

    Material: FR4 

    Copper Thickness: 1/H/H/1OZ

    Min Hole: 0.1MM

    Min Line: 3/3 Mil

    BGA Size: 8Mil

    Unit Size: 82*109.6MM/20UP

    Hole: L1-L4, L2-L3, L3-L4, L1-L2

    Min Distance Between Inner Layer Line to Holes: 5Mil

    Solder Mask: Green

    Surface Treatment: ENIG+OSP(OSP for BGA Pads)

    Special Treatment: Half Plated Holes

    Application: GPS Module

     

     

     

    Capabilities:

     

    Item Capability
    Layer Count 1-24 Layers
    Board Thickness 0.1mm-6.0mm
    Finished Board Max Size 700mm* 800mm
    Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    Warp <0.7%
    Major CCL Brand KB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material Type FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter 0.1mm-6.5mm
    Out Layer Copper Thickness 1/20Z-8OZ ;
    Inner Layer Copper Thickness 1/3OZ-6OZ
    Aspect Ratio 10:1
    PTH Hole Tolerance +/-3mil
    NPTH Hole Tolerance +/-1mil
    Copper Thickness Of PTH Wall >10mil(25um)
    Line Width And Space 2/2mil
    Min Solder Mask Bridge 2.5mil
    Solder Mask Alignment Tolerance +/-2mil
    Dimension Tolerance +/-4mil
    Max Gold Thickness 200u'(0.2mil)
    Thermal Shock 288C, 10s, 3 Times
    Impedance Contro +/-10%
    LTest Capability PAD Size Min 0.1mm
    Min BGA 7mil
    Surface Treatment OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable


     

    FAQ:

     

    Question: What is the most common quality issue for this kinf of pcb?

    Answer: 1) Copper burr in half holes

                  2) Oxidation in half holes

     

    Question: Why use surface treatment ENIG+OSP?

    Answer: OSP has good tin solder paste feature . The BGA size is only 8mil. If use immersion gold, it's not good for tin solder paste. So we suggest customer to use ENIG+OSP. It can protect other pads well and meanwhile, it makes sure that the BGA pads have good tin solder paste feature. 

     

    Question: Is the cost for ENIG+OSP higher than ENIG?

    Answer: Yes it is. But it won't make a big difference. 

     

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)