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7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB

7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB

    • 7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB
    • 7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB
    • 7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB
    • 7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB
  • 7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S02E4678A0

    Payment & Shipping Terms:

    Minimum Order Quantity: Negotiable
    Price: Negotiable
    Packaging Details: 40pcs/bag, 20bags/carton
    Delivery Time: 12 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
    Contact Now
    Detailed Product Description
    PCB Type: High Frequency PCB Material: Rogers RO4350B
    Layer Count: 2 Layer Copper Thickness: 1/1OZ
    Surface Treatment: ENIG Min Hole: 0.5MM
    Min Trace: 21.6/6Mil
    High Light:

    RO4350B 2 Layer PCB

    ,

    ENIG 2 Layer PCB

    ,

    1.0MM 2 Layer PCB

    2 Layer Rigid Printed Circuit Board , High Frequency Rogers RO4350B Material

     

    PCB Specifications:

     

    Layer Count: 2 Layer Rigid PCB

    Material: RO4350B  Quick-Reference-Processing-Guidelines-RO4003C-RO43...

    Board Thickness: 1.0MM

    Min Hole: 0.5MM

    Unit Size: 109MM*92MM/1SET

    Surface Treatment: ENIG

     

     

    Capabilities:

     

    NO Item Capability
    1 Layer Count 1-24 Layers
    2 Board Thickness 0.1mm-6.0mm
    3 Finished Board Max Size 700mm*800mm
    4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    5 Warp <0.7%
    6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
    7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
    8 Drill Hole Diameter 0.1mm-6.5mm
    9 Out Layer Copper Thickness 1/2OZ-8OZ
    10 Inner Layer Copper Thickness 1/3OZ-6OZ
    11 Aspect Ratio 10:1
    12 PTH Hole Tolerance +/-3mil
    13 NPTH Hole Tolerance +/-1mil
    14 Copper Thickness of PTH Wall >10mil(25um)
    15 Line Width And Space 2/2mil
    16 Min Solder Mask Bridge 2.5mil
    17 Solder Mask Alignment Tolerance +/-2mil
    18 Dimension Tolerance +/-4mil
    19 Max Gold Thickness 200u'(0.2mil)
    20 Thermal Shock 288℃, 10s, 3 times
    21 Impedance Control +/-10%
    22 Test Capability PAD Size min 0.1mm
    23 Min BGA 7mil
    24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

     


    FAQ:

     

    Question: What is PCB Etch Factor?

    Answer: PCB Etch Factor or etch compensation is an etching process modification used by the PCB manufacturers to decide the extent and accuracy of etching. It helps the designers and manufacturers decide the minimum etching allowance on the track width. During etching, unwanted copper is removed gradually from the PCB surface to realize the desired conductive track. For instance, if a PCB design requires a track width of 0.25 mm, then the manufacturer has to initiate etching if the track width is more than 0.25 mm. The amount by which the track width is increased is called etch factor. It is proportional to the copper weight required to be removed. More copper to be removed indicates a higher value of the etch factor.

    No etching process gives perfect straight cuts, they always create undercut, an etching defect, which can be seen in the figure below.

    7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB 0

    In mathematical terms, an etch factor is the ratio of track width to the amount of undercut. The PCB CAD designer has to provide enough spacing in the design so that a manufacturer is able to utilize that space to start etching with a little wider track. The minimum spacing in the design must meet the manufacturer’s decided minimum space.

    7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB 1

     

     

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)