Home ProductsGold Finger PCB

8 Layer Gold Finger PCB / Circuit Board Fingers Green Solder Mask 1.6MM Thick

8 Layer Gold Finger PCB / Circuit Board Fingers Green Solder Mask 1.6MM Thick

    • 8 Layer Gold Finger PCB / Circuit Board Fingers Green Solder Mask 1.6MM Thick
  • 8 Layer Gold Finger PCB / Circuit Board Fingers Green Solder Mask 1.6MM Thick

    Product Details:

    Place of Origin: CHINA
    Brand Name: WITGAIN PCB
    Certification: UL CERTIFICATE
    Model Number: P08E2775A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 20pcs/bag, 10bags/carton
    Delivery Time: 25 work days
    Payment Terms: T/T
    Supply Ability: 500kpcs/month
    Contact Now
    Detailed Product Description
    Material: FR4 Layer Count: 8 Layer
    Thickness: 1.6MM Min Hole: 0.3MM
    Min Trace: 6/6Mil Gold Thickness: 35U'
    Color: Green Surface Treatment: Immersion Gold+Plating Gold On Fingers
    Copper: 1/1/1/1/1/1/1/1OZ Application: Test Equipment
    High Light:

    circuit board gold fingers

    ,

    pcb goldfinger

    8 Layer Gold Finger Printed Circuit Board , Gold Finger PCB , Green Solder Mask

     

    PCB Specifications:

     

    Layer Count: 8Layer Gold Finger PCB

    Board Thickness: 1.6MM

    Material: FR4 

    Copper Thickness: 1/1/1/1/1/1/1/1OZ

    Min Hole: 0.3MM

    Min Line: 6/6 Mil

    Hole: L1-L8

    Solder Mask: Green

    Surface Treatment: ENIG+GOLD FINGER

    Gold Thickness: 35U'+2U'

    Application: Test Equipment

     

     

    Capabilities:

     

    Item Capability
    Layer Count 1-24 Layers
    Board Thickness 0.1mm-6.0mm
    Finished Board Max Size 700mm* 800mm
    Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    Warp <0.7%
    Major CCL Brand KB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material Type FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter 0.1mm-6.5mm
    Out Layer Copper Thickness 1/20Z-8OZ ;
    Inner Layer Copper Thickness 1/3OZ-6OZ
    Aspect Ratio 10:1
    PTH Hole Tolerance +/-3mil
    NPTH Hole Tolerance +/-1mil
    Copper Thickness Of PTH Wall >10mil(25um)
    Line Width And Space 2/2mil
    Min Solder Mask Bridge 2.5mil
    Solder Mask Alignment Tolerance +/-2mil
    Dimension Tolerance +/-4mil
    Max Gold Thickness 200u'(0.2mil)
    Thermal Shock 288C, 10s, 3 Times
    Impedance Contro +/-10%
    LTest Capability PAD Size Min 0.1mm
    Min BGA 7mil
    Surface Treatment OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable


     

    FAQ:

     

    Question: What is the lead time for 8 layer gold finger pcb?

    Answer: The standard lead time for sample is 3 weeks, for production is 4 weeks.

     

     

    Question: What are PCB Gold Fingers?

    Answer:   Gold Fingers are the gold plated narrow connectors found on the edge of printed circuit boards to enable connections between multiple boards. They are made from flesh gold, the hardest form of gold available and work for a long time with superior conductivity. The thickness of gold fingers usually ranges from 3 to 50 microns.  Gold is chosen for these fingers as it has the highest corrosion resistance and electrical conductivity after Copper and Silver. Sometimes, Gold is combined with Cobalt and Nickel to increase the resistance of the fingers for wear and tear. PCBs are connected/disconnected from each other multiple times. So these connection points (fingers) need to be able to handle some wear and tear.

     

    Quesion:What is PCB Gold Finger Beveling?

    Answer: The PCB Gold Fingers plating process starts after the solder mask deposition and before the surface finish. It includes the following steps:

    1. Nickel plating: Initially, between 2 to 6 microns of Nickel is plated to the connector edges of the fingers.

    2. Gold Plating: In this step, between 1 to 2 microns of hard Gold is plated over the Nickel layer. In general practice, Cobalt is also added to Gold to boost the surface resistance.

    3. Beveling: The edges are then beveled/ tapered at a particular angle (30 to 45 degree) to make easier insertion to the corresponding slot

    Design Specifications for PCB Gold Fingers:

    • The inner PCB layers towards the PCB edges must be Copper-free, to prevent exposure at the time of Beveling.

    • It is not advisable to include the plated through holes (PTH) within 1 mm of Gold Fingers.

    • Maintain at least 0.5 mm of distance between the gold fingers and the board outline.

    • Any compromise with the standard spacing values can lead to weak and malfunctioned PCB board.

    • No soldermask or screen printing should be performed near the Gold Fingers.

    • The Gold Fingers should be placed facing outwards from the PCB’s center.

     

    8 Layer Gold Finger PCB / Circuit Board Fingers Green Solder Mask 1.6MM Thick 0

    PCBs with Non-uniform Gold Fingers:

    For some PCBs, the gold fingers are intended to be shorter than others. The most relevant example of such PCB is the one used for memory card readers, where the device linked with long fingers must be powered first to those connected with the shorter fingers.

    PCBs with Segmented Gold Fingers

    Segmented gold fingers vary in length and some of them are also disjoined within the same fingers of the same PCB. Such PCBs are suitable for water-resistant and rugged electronics.

    pcb gold finger.jpg

    Quality Measures for PCB Gold Fingers:

    The Association Connecting Electronics Industries (IPC) has prescribed some standards for the production of PCB Gold Fingers. The IPC standards are summarized as follows:

    • Chemical composition: To achieve maximum rigidity along the edges of PCB Gold Fingers, the gold plating should consist of between 5 to 10% Cobalt.
    • Thickness: The plating thickness should be in the range of 2 to 50 microinches. The standard thicknesses by size are 0.031 inches, 0.062 inches, 0.093 inches, and 0.125 inches.
    • Visual test: The visual inspection is performed through a magnifying lens. The contact edges should be smooth, have a clean surface and also be free from excess plating like Nickel.
    • Tape test: It is conducted to check the adhesiveness of the gold plating along the contacts. In this test, a strip of tape is fastened over the contact edges followed by removing the same. In the next step, the tape is inspected for traces of plating. If any gold is visible on the tape, then the plating is considered as insufficient for continuous injection and ejection.

     

    Exhibitions:

     

    8 Layer Gold Finger PCB / Circuit Board Fingers Green Solder Mask 1.6MM Thick 2

     

     

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)