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8 Layer HDI PCB Board

8 Layer HDI PCB Board

    • 8 Layer HDI PCB Board
    • 8 Layer HDI PCB Board
    • 8 Layer HDI PCB Board
    • 8 Layer HDI PCB Board
    • 8 Layer HDI PCB Board
    • 8 Layer HDI PCB Board
    • 8 Layer HDI PCB Board
  • 8 Layer HDI PCB Board

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S08E4630B0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 40pcs/bag, 20bags/carton
    Delivery Time: 15 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/lot
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    Detailed Product Description
    Layer Count: 8 Layer Min Hole: 0.1MM
    Min Trace: 3/3Mil BGA Size: 8.6Mil
    Solder Mask: Green Surface Treatment: ENIG
    High Light:

    FR4 HDI Printed Circuit Board


    8 Layer HDI PCB Board


    ENIG HDI PCB Board

    8 Layer Printed Circuit Board With Blind And Buried Holes



    PCB Specifications:


    Layer Count: 8 Layer HDI PCB

    Board Thickness: 1.2MM

    Material: FR4 S1000-2 S1000-2 DATA SHEET.pdf

    Min Hole: 0.1MM

    Min Line: 3/3 Mil

    BGA Size: 8.66Mil

    Unit Size: 135MM*104MM/2UP

    Blind Holes: L1-L2 , L1-L3, L7-L8, L6-L8  0.1MM

    Buried Holes: L2-L3, L3-L6, L6-L7 0.1MM

    Via Holes: L1-L8 0.2MM

    Solder Mask: Green

    Surface Treatment: ENIG

    Application: Access Scanning Device



    Our Capability:


    8 Layer HDI PCB Board 0






    Question: What is Via Plugging?

    Answer: Via plugging is a process in which vias are completely filled with resin or closed with solder mask. This technique is different from via tenting where resin/solder mask doesn’t fill the via hole but just provides a covering.

    8 Layer HDI PCB Board 1

    8 Layer HDI PCB Board 2

    Via plugging is done as a preventive measure to secure the vias from the unwanted flow of solder material during the assembly/soldering process. During the soldering process, if a via is not plugged or tented, the solder can flow down the via from the pads and can creates unnecessary solder joints.

    Via plugging can be done through conductive or non-conductive material. The conductive filled vias help to carry a large amount of current from one side of the PCB board to another. However, the main drawback of conductive filled vias is the difference in CTE (Coefficient of Thermal Expansion) between the conductive fill and surrounding laminate. During PCB operation, the conductive material will heat and expand at faster rate than the surrounding laminate, which can cause a fracture between the via wall and associated contact pad.

    The via holes filled with non-conductive materials will still function like normal vias. However they will not be able to carry higher current loads like those filled with conductive materials.


    Quesion: What is Via in Pad?

    Answer: ‘Via in Pad’ is when the via is placed directly on the pad of a surface mount component. Once this is done, the via is filled with conductive or non-conductive epoxy, followed by capping and electrochemical plating to make it virtually invisible. Such type of arrangement results in buried via within the PCB surface that can be completely soldered as standard SMT lands.

    The Via in Pad can be filled using non-conductive epoxy, conductive epoxy, copper, or silver followed by electrochemical plating. 

    8 Layer HDI PCB Board 3


    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)