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Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards

Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards

    • Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards
    • Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards
    • Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards
    • Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards
    • Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards
    • Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards
  • Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S04E4696A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 120pcs/bag, 20bags/carton
    Delivery Time: 18 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
    Contact Now
    Detailed Product Description
    Layer Count: 4 Layer Material: FR4
    Blind Hole: L1-L2 0.1MM Via Hole: L1-L4 0.2MM
    Solder Mask: Black Surface Treatment: ENIG
    High Light:

    PCB HDI Printed Circuit Boards

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    4 Layer HDI PCB Board

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    FR4 HDI Printed Circuit Boards

    4 Layer Printed Circuit Board With Blind Holes

     

     

    PCB Specifications:

     

    Layer Count: 4Layer HDI PCB

    Board Thickness: 1.6MM

    Material: FR4 TG150

    Copper Thickness: 1/H/H/1OZ

    Min Hole: 0.1MM 

    Blind Holes: L1-L2 0.1MM

    Via Holes: L1-L4 0.2MM

    Min Line: 6/8 Mil

    BGA Size: 8.5Mil

    Unit Size: 100M*110MM/6UP

    Solder Mask: Black

    Surface Treatment: Immersion Gold

     

     

     

     

    Capabilities:

     

    Item Capability
    Layer Count 1-24 Layers
    Board Thickness 0.1mm-6.0mm
    Finished Board Max Size 700mm* 800mm
    Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    Warp <0.7%
    Major CCL Brand KB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material Type FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter 0.1mm-6.5mm
    Out Layer Copper Thickness 1/20Z-8OZ ;
    Inner Layer Copper Thickness 1/3OZ-6OZ
    Aspect Ratio 10:1
    PTH Hole Tolerance +/-3mil
    NPTH Hole Tolerance +/-1mil
    Copper Thickness Of PTH Wall >10mil(25um)
    Line Width And Space 2/2mil
    Min Solder Mask Bridge 2.5mil
    Solder Mask Alignment Tolerance +/-2mil
    Dimension Tolerance +/-4mil
    Max Gold Thickness 200u'(0.2mil)
    Thermal Shock 288C, 10s, 3 Times
    Impedance Contro +/-10%
    LTest Capability PAD Size Min 0.1mm
    Min BGA 7mil
    Surface Treatment OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable


     

    FAQ:

     

    Quesion: What is Soak Testing or Endurance Testing of a PCB Board?

    Answer: Soak Testing also known as Load Testing or Endurance testing is test performed to check the stability of the PCB over various extreme operating conditions for extended periods of time. For example, a PCB board may perform normally when used for 2 hours, but when the same board is used for 10 hours or more than that, then it may fail. Soak Testing is done to evaluate how the board will operate under different operating conditions for extended periods of time. Soak Testing should be done before the final deployment of the board.

     

    Question: What is PCB Grid Testing or Bed of Nails Testing?

    Answer:  Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains various pins inserted into an epoxy phenolic glass cloth laminated sheet (G-10) in order to access all the PCB test points. These pins act as sensors which are aligned to make contact with the test points on the PCB board and are also connected with a measuring unit through wires. The position of the pins is designed and customized for each PCB based on the components or points on the board that need to be tested.

    Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards 0

    A grid testing machine has three building blocks - a fixture, a bed of nails and software, to control the overall functionality of the machine. It usually has two cameras which are placed on the top and bottom of the machine in order to scan the whole board.

    Advantages of PCB Grid Testing:

    • Very Reliable method of PCB testing as all the points on the PCB board can be tested simultaneously.
    • Offers very good accuracy since it uses two cameras
    • Can easily detect manufacturing defects
    • An in-circuit tester is easy to program
    • Interpretation of test results is quite easy
    • It checks for Open, shorts, mission components, Wrong polarity, defective components, and current leakages in the circuit
    • Most of the parameters can be checked without applying power to the PCB under test

    Limitations of PCB Grid Testing:

    • Fixtures used in bed of nails testing are expensive since they are mechanical and require a different wiring assembly for a different PCB board
    • Fixtures are mechanical so any change in the number of pins or their position require extra cost
    • This test doesn’t test continuity through connectors so there are the chances that the connectors’ faults may remain unnoticed.
    • Faults related to solder joints, excess solder, solder quality, and solder void also remain unidentified

    This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.

     

     

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)