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Custom Green Fr4 HDI PCB Board / 10 Layer Pcb Black Solder Mask 7Mil BGA

Custom Green Fr4 HDI PCB Board / 10 Layer Pcb Black Solder Mask 7Mil BGA

    • Custom Green Fr4 HDI PCB Board / 10 Layer Pcb Black Solder Mask 7Mil BGA
    • Custom Green Fr4 HDI PCB Board / 10 Layer Pcb Black Solder Mask 7Mil BGA
    • Custom Green Fr4 HDI PCB Board / 10 Layer Pcb Black Solder Mask 7Mil BGA
  • Custom Green Fr4 HDI PCB Board / 10 Layer Pcb Black Solder Mask 7Mil BGA

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: P10E3665AO

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 100pcs/bag, 20bags/carton
    Delivery Time: 25 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
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    Detailed Product Description
    Material: FR4, TG170 Board Thickness: 1.0MM
    Color: Black Min Hole: 4Mil
    Min Trace: 2.5/2.5Mil BGA: 7Mil
    Copper Thickness: 1/H/H/H/H/H/H/H/H/H/1OZ Surface Treatment: Immersion Gold
    High Light:

    hdi printed circuit boards


    electronic pcb board

    10 Layer HDI PCB Board , Printed Circuit Board , Blind And Buried Holes , Black Solder Mask


    PCB Specifications:


    Layer Count: 10 Layer HDI PCB

    Material: FR4, TG170

    Board Thickness: 1.0MM

    Min Hole: 0.1MM

    Hole Stucture: L1-L2,L2-L3,L3-L4,L5-L6,L6-L7,L7-L8,L8-L9,L9-L10,L1-L3,L8-L10,L2-L4,L7-L9,L1-L10

    Min Trace: 2.5/2.5Mil

    BGA: 7Mil

    Aspect Ratio: 10:1

    Solder Mas: Black

    Surface Treatment: ENIG

    Application: 5G Fiber Module





    Item Capability
    Layer Count 1-24 Layers
    Board Thickness 0.1mm-6.0mm
    Finished Board Max Size 700mm* 800mm
    Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    Warp <0.7%
    Major CCL Brand KB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material Type FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter 0.1mm-6.5mm
    Out Layer Copper Thickness 1/20Z-8OZ ;
    Inner Layer Copper Thickness 1/3OZ-6OZ
    Aspect Ratio 10:1
    PTH Hole Tolerance +/-3mil
    NPTH Hole Tolerance +/-1mil
    Copper Thickness Of PTH Wall >10mil(25um)
    Line Width And Space 2/2mil
    Min Solder Mask Bridge 2.5mil
    Solder Mask Alignment Tolerance +/-2mil
    Dimension Tolerance +/-4mil
    Max Gold Thickness 200u'(0.2mil)
    Thermal Shock 288C, 10s, 3 Times
    Impedance Contro +/-10%
    LTest Capability PAD Size Min 0.1mm
    Min BGA 7mil
    Surface Treatment OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable





    Question: How can you guarantee the quality of your products?

    Answer: About electricty function, we will 100% test it through flying tester or fixture test. About the surface, we have IPQC and FQC and FQA to make sure the products with flaw do not flow to customer's side. We also do microsection and thermal shock to make sure the reliability of our products.


    Question: What is the standard format you accept?

    Answer: We accept standard gerber format file.



    Question: Do you have MOQ requirements?

    Answer: Because PCB is customized products, so we do have MOQ requirements. But the MOQ rquirement is not strict and it differs from case to case.


    Question: What is the difference between your two factories?

    Answer: The HuiZhou factory mainly produce sample and small batch pcbs. The JiangXi factory has more roboticized equipments, so it prefers big batch production.


    Question: What is your shipping term?

    Answer: EX WORK, FCA SHENZHEN, FOB SHENZHEN ,FOB HONGKONG, or FCA Customer's City, it depends on customers demand. But we prefer EX WORK and FCA SHENZHEN


    Quesiont: What is ENIG?

    Answer:  ENIG (Electroless Nickel Immersion Gold) is a surface plating that is applied over the copper pads on a Printed Circuit Board to protect them from corrosion and other abnormalities. Initially, the copper pad is covered by a Nickel (Ni) layer followed by a thin immersion Gold (Au) layer. ENIG provides good oxidation resistance, excellent surface planarity and allows for easy soldering which results in excellent electrical performance of the PCB board.



    ENIG is RoHS compliant is therefore one of the most used PCB surface finishes even though it is more complex and expensive when compared to other PCB plating process like HASL.

    ENIG is a two-layer metallic coating – Nickle is the barrier to the copper pad and is also the materials to which the components are soldered. Gold on the other hand protects the Nickle during storage and also provides low contact resistance. Typical Nickle thickness varies from 4 – 7 µm and Gold thickness varies from 0.05 – 0 23 µm. ENIG requires a processing temperature of around 80 °C.

    Advantages of ENIG Surface Finishes:

    • It provides impressive wettability, surface planarity, coplanarity, and long shelf life (up to 12 months) to the PCB board since immersion gold has strong chemical properties.
    • In ENIG, the nickel layer acts as a barrier and stops the interfusion between gold and copper. It also produces an intermetallic compound (IMC) Ni3Sn4 to provide good solderability after reacting with Tin.
    • It has low contact resistance, high strength, reduces oxidation, and provides antifriction. Overall, it enhances circuit conductivity requirements.
    • It provides good plating over the copper pads and via holes.
    • Its excellent surface planarity allows the components to be soldered flat onto the pad, making it ideal for BGA pads and other fine-pitch components.
    • ENIG complies with all RoHS requirements.

    Limitations of ENIG Surface Finishes:

    • ENIG is an expensive surface finish technology
    • It has undesirable magnetic properties
    • Not good for rework and makes PCB repair very difficult



    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)