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ENIG HDI Printed Circuit Board

ENIG HDI Printed Circuit Board

    • ENIG HDI Printed Circuit Board
    • ENIG HDI Printed Circuit Board
    • ENIG HDI Printed Circuit Board
    • ENIG HDI Printed Circuit Board
    • ENIG HDI Printed Circuit Board
    • ENIG HDI Printed Circuit Board
  • ENIG HDI Printed Circuit Board

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: P10E4644A0

    Payment & Shipping Terms:

    Minimum Order Quantity: Negotiable
    Price: Negotiable
    Packaging Details: 40pcs/bag, 20bags/carton
    Delivery Time: 20 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/lot
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    Detailed Product Description
    Layer Count: 10 Layer Min Line: 3/3Mil
    Min Hole: 0.1MM Solder Mask: Green
    BGA SIZE: 10 Mil Surface Treatment: ENIG
    High Light:

    ENIG HDI Printed Circuit Board

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    10Mil BGA HDI PCB Board

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    1.8MM HDI PCB Board

    10 Layer Printed Circuit Board With Blind And Buried Holes

     

     

    PCB Specifications:

     

    PCB Type: HDI PCB ( High Density Interconnector)

    Layer Count: 10 Layer

    Board Thickness: 1.8MM

    Material: FR4 IT180A IT-180ATC-Data-sheet-rev-2.0-20-1.pdf

    Min Hole: 0.1MM

    Min Line: 3/3 Mil

    BGA Size: 10Mil

    Unit Size: 154MM*143MM/1UP

    Blind Holes: L1-L2 , L9-L10 0.1MM

    Buried Holes: L2-L9 0.2MM

    Via Holes: L1-L10 0.2MM

    Solder Mask: Green

    Surface Treatment: ENIG

    Application: Motor Industrial Control

     

     

    Our Capability:

     

    NO Item Capability
    1 Layer Count 1-24 Layers
    2 Board Thickness 0.1mm-6.0mm
    3 Finished Board Max Size 700mm*800mm
    4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    5 Warp <0.7%
    6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
    7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
    8 Drill Hole Diameter 0.1mm-6.5mm
    9 Out Layer Copper Thickness 1/2OZ-8OZ
    10 Inner Layer Copper Thickness 1/3OZ-6OZ
    11 Aspect Ratio 10:1
    12 PTH Hole Tolerance +/-3mil
    13 NPTH Hole Tolerance +/-1mil
    14 Copper Thickness of PTH Wall >10mil(25um)
    15 Line Width And Space 2/2mil
    16 Min Solder Mask Bridge 2.5mil
    17 Solder Mask Alignment Tolerance +/-2mil
    18 Dimension Tolerance +/-4mil
    19 Max Gold Thickness 200u'(0.2mil)
    20 Thermal Shock 288℃, 10s, 3 times
    21 Impedance Control +/-10%
    22 Test Capability PAD Size min 0.1mm
    23 Min BGA 7mil
    24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

     

     

     

    FAQ:

     

    Question: What is Glass Transition Temperature (Tg)?

    Answer:Tg or the glass transition temperature is the temperature at which the base material of a PCB starts to transform from a brittle/rigid form factor to a soft, elastic one. The Tg value of a printed circuit board usually depends on the substrate used. This is one of the factors that you must consider when selecting the substrate materials for your PCB. You should make sure that the temperature where your board will be used is about 20 degrees less than the Tg value of the selected substrate.

     

    Quesion: What is the Wetting Balance Test?

    Answer:  The Wetting Balance Test is conducted to measure the wetting forces between molten solder and the PCB as a function of time. The wetting balance test measures the time it takes for the solder to wet the termination pads of the component on a PCB.

    During the test, the PCB is inserted into and removed from a molten solder pot at high speeds (1 to 5 mm/ sec). The solder pot is held steady for 5 to 10 seconds while the PCB is inserted and removed in the vertical dimension. Forces like surface tension and buoyancy act on the board in the vertical dimension.

    The net active forces are measured using a linear variable differential transformer (LVDT) and used to draw a wetting balance curve to show the total force (mN) or normalized force (mN/mm) as a function of time. It provides information about the extent of wetting.

    ENIG HDI Printed Circuit Board 0

    Apart from wetting forces, there are rejecting (non-wetting) forces too, as plotted in the figure on the negative axis. The rejecting forces act in the upward direction and the wetting forces act in the downward direction.

    The rate of insertion of specimen is high enough that it reaches the depth of the solder pot before the wetting forces came into action. Initially, the rejecting forces are high, that’s why the curve rises from the negative axis. After some time, the wetting forces overcome the rejecting forces, which is depicted by the curve on the positive axis. The point where the magnitude of both the forces match each other, they cross the zero-axis called Time-to-Zero. When solder sticks to the PCB specimen, it compels it to move downward, resulting curve movement in the positive direction. The slope of the rising curve gives the indication of the wetting rate.

    The Wetting Balance test is fast, automated, and an entirely qualitative method, which only specifies whether the specimen under test has passed/ failed. We need a statistically-proven test method to get clear-cut information on solderability validation. For solderability evaluation, the wetting curve is divided into three pass/fail valuations based on IPC-J-STD-003 criteria.

     

     

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)