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FR4 Gold Finger PCB

FR4 Gold Finger PCB

    • FR4 Gold Finger PCB
    • FR4 Gold Finger PCB
    • FR4 Gold Finger PCB
  • FR4 Gold Finger PCB

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S02E4605B0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 20pcs/bag, 10bags/carton
    Delivery Time: 15 work days
    Payment Terms: T/T
    Supply Ability: 100kpcs/lot
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    Detailed Product Description
    Layer Count: 2 Layer Material: FR4 , TG170
    Material Brand: S1000-2 Surface Treatment: ENIG+Gold Fingers
    Solder Mask: Green Board Thickness: 1.6MM
    High Light:

    FR4 Gold Finger PCB


    1.6MM Gold Finger PCB


    2 Layer FR4 PCB Board

    2 Layer Rigid Printed Circuit Board , FR4 High TG Material , Gold Fingers



    PCB Specifications:


    Layer Count: 2 Layer Rigid PCB

    Material: FR4 S1000-2

    Copper Thickness: 1/1OZ

    Min Hole: 0.7MM

    Min Trace: 20/8.5Mil

    Solder Mask: Green

    Surface Treatment: ENIG+Gold Fingers



    Our Products&Services:


    FR4 Gold Finger PCB 0




    Question: What is ENEPIG Plating?

    Answer: ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is a type of surface plating applied on a Printed Circuit Board to protect it from environmental factors during storage and operation. ENEPIG is prepared by depositing electroless Nickel (Ni 3-5 μm), followed by electroless Palladium (Pd 0.05-0.1μm), and an immersion Gold layer (Au 0.03-0.05 μm). It is good for solder joint strength, gold wire bonding, aluminum wire bonding, and provides low contact resistance. It can easily be deposited on almost any PCB which is why it is also called the ‘Universal Finish’.

    FR4 Gold Finger PCB 1

    What are the advantages of ENEPIG over ENIG?

    ENEPIG plating has an additional layer of Palladium when compared to the ENIG plating which consist of just Nickel and Gold. This additional layer helps avoid what is know as the ‘Black Pad’ syndrome i.e. the result of corrosion caused by the Gold to the Nickel layer.

    Advantages of ENEPIG Finishes:

    • Palladium layer totally covers the Nickel layer, and the amount of phosphorus in the palladium layer is less than in the Nickel layer, which inhibits the generation of black nickel (also called Black Pad syndrome).
    • The Palladium fusion point (1,554°C) is higher than Gold (1,063°C). As a result of this, Palladium’s fusion speed at high temperatures is comparatively low, which allows more time for Nickel layer protection before going to the final assembly.
    • Palladium is harder than Gold, which offers improved solder joint quality, wire bonding capacity, and antifriction.
    • Using Palladium allows for the reduction in the thickness of the Gold layer, which eventually reduces the cost.
    • It can withstand multiple reflow cycles
    • Processing cost is comparatively lower than ENIG and ENEG surface finishes.
    • Very-well adjustable for Lead-free solder tendency

    Limitation of ENEPIG Surface Finish: It is more prone to fractures due to the brittleness of the tin-palladium layers formed on top of the nickel plating.

    Uses of ENEPIG Surface Finishes

    ENEPIG Surface Finishies are ideal for Printed Circuits Boards that support various package types including THT (through-hole technology), SMT, BGA, wire bonding, etc. They are often used in the aerospace & defense industry as well as the medical industry. ENEPIG finishes are used in high density, high performance devices.

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)