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FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards

FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards

    • FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards
    • FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards
    • FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards
    • FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards
    • FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards
    • FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards
  • FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S06EO4734A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 120pcs/bag, 20bags/carton
    Delivery Time: 20 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
    Contact Now
    Detailed Product Description
    Material: FR4 , TG150 Layer Count: 6 Layer
    Board Thickness: 0.6MM Surface Treatment: ENIG+OSP
    Solder Mask: Black Silkscreen: White
    High Light:

    0.6MM HDI Printed Circuit Boards

    ,

    6 Layer HDI PCB Board

    ,

    FR4 TG150 Printed Circuit Boards

     

    6 Layer Printed Circuit Board With Blind And Buried Holes

     

     

    PCB Specifications:

     

    Layer Count: 6Layer HDI PCB

    Board Thickness: 0.6MM

    Material: FR4 TG150

    Holes: L1-L2 0.1MM, L2-L5 0.15MM, L5-L6 0.1MM, L1-L6 0.5MM

    Min Line: 3.5/2.8 Mil

    BGA Size: 12Mil

    Unit Size: 113.42MM*92.88MM/6UP

    Blind Holes: L1-L2 , L5-L6 0.1MM

    Buried Holes: L2-L5 0.13MM

    Solder Mask: Black

    Surface Treatment: ENIG+OSP

    Application: Mobile Phone Charging Board

     

     

     

    Our Manufacturing Capabilities:

     

    NO Item Capability
    1 Layer Count 1-24 Layers
    2 Board Thickness 0.1mm-6.0mm
    3 Finished Board Max Size 700mm*800mm
    4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    5 Warp <0.7%
    6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
    7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
    8 Drill Hole Diameter 0.1mm-6.5mm
    9 Out Layer Copper Thickness 1/2OZ-8OZ
    10 Inner Layer Copper Thickness 1/3OZ-6OZ
    11 Aspect Ratio 10:1
    12 PTH Hole Tolerance +/-3mil
    13 NPTH Hole Tolerance +/-1mil
    14 Copper Thickness of PTH Wall >10mil(25um)
    15 Line Width And Space 2/2mil
    16 Min Solder Mask Bridge 2.5mil
    17 Solder Mask Alignment Tolerance +/-2mil
    18 Dimension Tolerance +/-4mil
    19 Max Gold Thickness 200u'(0.2mil)
    20 Thermal Shock 288℃, 10s, 3 times
    21 Impedance Control +/-10%
    22 Test Capability PAD Size min 0.1mm
    23 Min BGA 7mil
    24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc


     

     

    FAQ:

     

    Question: What are solder beads? How are they formed?

    Answer:  

    FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards 0

    Solder Beads are balls of solder that are created when soldering components on a PCB. They are created due to the use of excessive solder paste when soldering components on a board. Solder beads can cause a short circuit between the component terminals which can result in failure of the circuit. Also, in case there are vibrations, the solder ball can break loose and cause a short circuit somewhere else on the PCB. This is an undesirable phenomenon or defect in SMT (Surface Mount Technology).

    Due to the solder beads, there may be a chance of occurrence of an electrical short circuit between terminals of chip resistors or capacitors or ICs where it was formed. Also, if any vibration in PCB due to any reason, there may be a chance of the solder bead to break loose and move across PCB and make short circuits anywhere on the board. It is an undesirable phenomenon or defect in SMT.

    How does solder beading occur?

    The pads of PCB contain the solder paste. The required components (Chip Resistor, Capacitors or other IC) of a circuit are placed on the corresponding pads, and the PCB is sent into the reflow oven. In the reflow oven due to heat, the solder paste starts to melt-down. If there is excessive solder paste, some solder paste separates from the main solder paste on the pads and ends up underneath the component.

    FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards 1

    Solder stuck underneath the component

    The solder stuck underneath the component does not return to solder pads and tends to form a ball of solder also known as a solder bead. During the cooling process, the surface tension of the cooling solder pulls the component closer to the pads. Here, the component is drawn down, towards the board and as a result the solder squeezes out on the side of the component in the form of a bead or ball.

    FR4 TG150 6 Layer 0.6MM HDI Printed Circuit Boards 2

    Solder bead squeezes out the side of the component and remains there

    How to prevent solder bead formation?

    Manual removal of solder removal is expensive and impractical. It is better to eliminate the solder beads before they occur. Since solder beading is usually caused by the use of excessive solder paste on the pads, the best solution would be to reduce the amount of solder paste being applied to the pads. This can be done by using the following ways:

    1. Increasing Stencil Thickness

    2. Modifying Aperture shape/size

    3. Changing viscosity of the Solder paste

    4. Adjusting the reflow profile

    5. Modifying the Squeegee speed and pressure

    What causes for Solder beading formation?

    Solder beading is caused by the use of excessive solder paste on the solder pads of a PCB. Other factors include the closeness of pads on a PCB, the shape of the pads, the reflow or melting profile used, and environmental conditions.

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)