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HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB

HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB

    • HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB
    • HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB
    • HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB
    • HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB
    • HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB
  • HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S04F4726A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 15pcs/bag, 10bags/carton
    Delivery Time: 15 work days
    Payment Terms: T/T
    Supply Ability: 500kpcs/month
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    Detailed Product Description
    Material Type: FR4 Board Thickness: 3.5MM
    Material Brand: IT180A Solder Mask: Green
    Copper Thickness: 3/3 OZ Surface Treatment: HASL
    High Light:

    3OZ Thick Copper PCB


    FR4 Thick Copper PCB


    Double Layer Thick Copper PCB

    2 Layer Thick Copper PCB



    PCB Specifications:


    Layer Count: 2 Layer PCB

    Material: FR4, IT180A

    Board Thickness: 3.5MM

    Min Hole: 0.3MM

    Min Trace: 20/10Mil

    Copper: 3/3OZ

    Solder Mas: Green

    Unit Size: 165MM*144MM/1pcs

    Surface Treatment: HASL

    Application: Power Supply





    Item Capability
    Layer Count 1-24 Layers
    Board Thickness 0.1mm-6.0mm
    Finished Board Max Size 700mm* 800mm
    Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    Warp <0.7%
    Major CCL Brand KB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material Type FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter 0.1mm-6.5mm
    Out Layer Copper Thickness 1/20Z-8OZ ;
    Inner Layer Copper Thickness 1/3OZ-6OZ
    Aspect Ratio 10:1
    PTH Hole Tolerance +/-3mil
    NPTH Hole Tolerance +/-1mil
    Copper Thickness Of PTH Wall >10mil(25um)
    Line Width And Space 2/2mil
    Min Solder Mask Bridge 2.5mil
    Solder Mask Alignment Tolerance +/-2mil
    Dimension Tolerance +/-4mil
    Max Gold Thickness 200u'(0.2mil)
    Thermal Shock 288C, 10s, 3 Times
    Impedance Contro +/-10%
    LTest Capability PAD Size Min 0.1mm
    Min BGA 7mil
    Surface Treatment OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable





    Question: What is Loss Tangent?

    Answer: In PCBs, Loss tangent (tan (δ)) is the measure of signal loss due to the inherent dissipation of electromagnetic energy in the substrate of the printed circuit board. It is a dimensionless quantity and generally referred to: Loss Factor, Tan δ, Dissipation factor and Loss angle.

    All PCB materials have both conduction losses and dielectric losses. The conduction losses are resistive and are caused by the conductive copper layer used in the board. The dielectric losses on the other hand are associated with the substrate (insulating material) used in a PCB. When the electric field is applied, polarization occurs and charges are displaced relative to the electric field. Dielectric losses cause a reduction in the overall electric field.

    HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB 0

    The total amount of polarization that can occur in a dielectric depends upon the molecular symmetry of the insulator material and is called Dipole Moment. The effect of the dipole moment in a dielectric substrate is termed Loss Tangent.

    Mathematically, the loss tangent is the phase angle between the resistive and reactive components of a system with permittivity. A low value of loss tangents results in a "fast" substrate while large value results in a "slow" substrate.

    HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB 1

    The formula for Loss Tangent or the Dissipation Factor is:

    HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB 2

    where δ is the loss angle, θ is the phase angle, f is the frequency, Rp is the equivalent parallel resistance, and Cp is the equivalent parallel capacitance.

    The signal loss by the dielectric material depends upon the material’s structure and glass-resin composition. Selection of low loss materials is the major task for manufacturers that is why they are advised to plot the attenuation equation against frequency for various material choices.

    Loss tangent plays a crucial factor for very high frequencies above 1 GHz and analog signals to determine the signal attenuation.


    Quesion: What is the Solder Mask?

    Answer: Solder mask or solder resist is a coating applied to a Printed Circuit Board (PCB) to protect the copper traces on the board and to stop electrical shorts. The solder mask is usually applied on both sides of the PCB i.e Top and Bottom to ensure reliability and performance.

    The solder mask is a Liquid UV Photo-imageable Ink which is usually green in color. Other color options like red, blue, yellow, white, black and purple are also available. This is something you need to ask your PCB fabricator.

    Solder mask and solder mask swell

    In the image above, the light green line is the solder mask layer. As you can see, the solder mask covers the entire trace, leaving only the pads exposed which are required to make electrical connections.

    What is the purpose of using a solder mask?

    • To prevent short circuits and protect the copper traces on the board.
    • To protects the traces from exposure to air which can cause oxidation and corrosion of traces.

    What material is used for solder mask?

    Resin is usually selected as the main material for solder mask because it works exceptionally well in terms of humidity resistance, insulation, solder resistance and high-temperature resistance.

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)