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8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole

8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole

    • 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole
    • 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole
    • 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole
    • 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole
    • 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole
    • 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole
    • 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole
  • 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: S08EO4429A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 240pcs/bag , 20 bags/carton
    Delivery Time: 25 work days
    Payment Terms: T/T
    Supply Ability: 1kkpcs/month
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    Detailed Product Description
    PCB Type: HDI And Half Hole Layer Count: 8 Layer
    Material: FR4 , IT180A Board Thickness: 1.0MM
    Surface Treatment: ENIG+OSP Solder Mask: Green
    High Light:

    hdi printed circuit boards

    ,

    copper clad pcb board

    8 Layer HDI Printed Circuit Board , Blind And Buried Holes , 1.0MM , FR4 IT180A Material

     

    8 Layer Printed Circuit Board With Blind And Buried Holes

     

     

    PCB Specifications:

     

    Layer Count: 4Layer Half Plated Hole PCB

    Board Thickness: 1.0MM

    Material: FR4 IT180A

    Min Hole: 0.1MM

    Min Line: 3/3 Mil

    BGA Size: 8Mil

    Unit Size: 122*114MM/12UP

    Blind Holes: L1-L2 , L7-L8 0.1MM

    Buried Holes: L2-L3 , L6-L7 0.1MM , L3-L6 0.2MM

    Via Holes: L1-L8 0.8MM

    Min Distance Between Inner Layer Line to Holes: 6Mil

    Solder Mask: Green

    Surface Treatment: ENIG+OSP(OSP for BGA Pads)

    Special Treatment: Half Plated Holes

    Application: GPS Module

     

     

     

    Other PCB Show:

     

    8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole 0


     

    FAQ:

     

    Question: What is the most common quality issue for this kinf of pcb?

    Answer: 1) Copper burr in half holes

    2) Oxidation in half holes

     

    Question: Why use surface treatment ENIG+OSP?

    Answer: OSP has good tin solder paste feature . The BGA size is only 8mil. If use immersion gold, it's not good for tin solder paste. So we suggest customer to use ENIG+OSP. It can protect other pads well and meanwhile, it makes sure that the BGA pads have good tin solder paste feature.

     

    Question: Is the cost for ENIG+OSP higher than ENIG?

    Answer: Yes it is. But it won't make a big difference.

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)