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Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold

Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold

    • Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold
    • Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold
    • Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold
    • Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold
    • Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold
  • Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold

    Product Details:

    Place of Origin: China
    Brand Name: WITGAIN PCB
    Certification: UL Certificate
    Model Number: P06E3820A0

    Payment & Shipping Terms:

    Minimum Order Quantity: negotiable
    Price: negotiable
    Packaging Details: 40pcs/bag, 20bags/carton
    Delivery Time: 20 work days
    Payment Terms: T/T
    Supply Ability: 500kpcs/month
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    Detailed Product Description
    Layer Count: 6 Layer Material: FR4
    Board Thickness: 1.6MM Solder Mask: Green
    Surface Treatment: ENIG Material Brand: SY , S2600F
    High Light:

    6 layer printed circuit board

    ,

    custom made circuit boards

    6 Layer Printed Circuit Board , FR4 Material , S2600F , Immersion Gold

     

    6 Layer Printed Circuit Board

     

     

     

    PCB Specifications:

     

    Layer Count: 6 Layer Rigid PCB:

    Material: FR4 S2600F

    Board Thickness: 1.6MM

    Min Hole: 0.3MM

    Min Trace: 5/5Mil

    BGA Size: 12Mil

    Solder Mask: Green

    Surface Treatment: ENIG

    Application: Power Supply

     

     

    Capabilities:

     

    Item Capability
    Layer Count 1-24 Layers
    Board Thickness 0.1mm-6.0mm
    Finished Board Max Size 700mm* 800mm
    Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
    Warp <0.7%
    Major CCL Brand KB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material Type FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter 0.1mm-6.5mm
    Out Layer Copper Thickness 1/20Z-8OZ ;
    Inner Layer Copper Thickness 1/3OZ-6OZ
    Aspect Ratio 10:1
    PTH Hole Tolerance +/-3mil
    NPTH Hole Tolerance +/-1mil
    Copper Thickness Of PTH Wall >10mil(25um)
    Line Width And Space 2/2mil
    Min Solder Mask Bridge 2.5mil
    Solder Mask Alignment Tolerance +/-2mil
    Dimension Tolerance +/-4mil
    Max Gold Thickness 200u'(0.2mil)
    Thermal Shock 288C, 10s, 3 Times
    Impedance Contro +/-10%
    LTest Capability PAD Size Min 0.1mm
    Min BGA 7mil
    Surface Treatment OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable

     

    FAQ:

     

    Question: What is via in pad

    Answer: For some pcbs, due to the limited space, the via holes need to be designed on BGA pad. In order to meet this design requirement, we need to drill the hole on bga pad first, then PTH the hole and use resin to plug in the hole. From the pad surface, we won't see any holes. So it won't affect SMT function.

     

    Contact Details
    Witgain Technology Ltd

    Contact Person: Steven

    Tel: +8613826589739

    Send your inquiry directly to us (0 / 3000)