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HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: HDIPCB0009
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
Place Of Origin:: Guangdong China Material:: FR4 TG>180
No Of Layers:: 10 Layers Solder Mask Colour:: Green
Surface Technics:: ENIG Min Lind Space&Width:: 3/3mil
High Light:

Blind Hole printed circuit board prototype

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Buried Hole printed circuit board prototype

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HDI High Density Interconnected Printed Circuit Board


Product Description

HDI PCB High Density Interconnected Printed Circuit Board With Blind And Buried Holes

 

 

  • Main Features: 

 

1 10 Layer HDI PCB, high density printed circuit board.

2  Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L9-L10 0.1MM, L8-L9 0.1MM

3  Buried holes: L4-L7 0.2MM.

4  Via holes: L1-L10 0.2MM.

5  PCB thickness is 1.0mm.

6  Min BGA ball size is 8mil.

7  Min line space and width is 3/3mil.

8  Material is FR4 Substrate, tg180 degree

9  S1000-2 material used.

 

 

  • S1000-2 Material data sheet:

 

 

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4 DMA 185
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

  • FAQ:

 

Q1: What is HDI PCB?

A1: HDI is the abbreviation of high density interconnector. Generally, there are blind and buried holes in HDI PCB. Due to the space limits, some product need to very small size pcb. HDI pcb was generated to save space and increase interconnectors.

 

 

 

 

 

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