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Blue Solder Mask OSP Coating PCB 4 Layer Printed Circuit Board

Basic Information
Place of Origin: China
Certification: UL
Model Number: PCB0029
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
Place Of Origin:: Guangdong China Material:: FR4 TG>170
No Of Layers:: 4 Layer Solder Mask Colour:: Blue
Surface Technics:: OSP Min Lind Space&Width:: 4/4mil
High Light:

OSP Coating PCB Circuit Board


4 Layer OSP Coating PCB


Blue Solder Mask PCB

Product Description

4 Layer Printed Circuit Board Blue Solder Mask OSP Treatment



PCB Main Features:


1  4 Layer customized printed circuit board.

2  OSP treatment Organic Solderability Preservatives.

3  1OZ copper on each layer.

4  Blue solder mask.

5  4 Layer with very precised line width&space.

6 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated

7 Our product is customized product.




S1170G Material Data Sheet:


Items Method Condition Unit Typical Value
Tg IPC-TM-650 DMA 180
Td IPC-TM-650 5% wt. loss 390
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 210
50-260℃ % 2.3
T260 IPC-TM-650 TMA min 60
T288 IPC-TM-650 TMA min 60
Thermal Stress IPC-TM-650 288℃, solder dip -- pass
Volume Resistivity IPC-TM-650 After moisture resistance MΩ.cm 5.65 x 107
E-24/125 MΩ.cm 2.71 x 107
Surface Resistivity IPC-TM-650 After moisture resistance 5.99 x 106
E-24/125 4.44 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 180
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 45+kV NB
Dissipation Constant (Dk) RC52% IPC-TM-650 1GHz -- 4.4
Dissipation Factor (Df) RC52% IPC-TM-650 1GHz -- 0.01
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.3
125℃ N/mm 1.1
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 550
CW IPC-TM-650 2.4.4 A MPa 450
Water Absorption IPC-TM-650 E-1/105+D-24/23 % 0.12
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0





Q1: What is OSP


A1:  The overall functionality of a PCB board depends upon the conductivity of copper tracks. These tracks tend to oxidize when exposed to the atmosphere, and creates problems when soldering during component placement. OSP or Organic Solderability Preservative does two things: temporarily protect exposed copper from being oxidized and improves solderability before component fixation (assembly).

OSP creates a very thin (100-4000 Angstroms) organic coating on the PCB board, which is a water-based chemical compound of ‘Azole family’ such as benzotriazoles, imidazoles, and benzimidazoles. This compound gets absorbed by the exposed copper and generates a protected film to prevent oxidization.


Advantages of OSP:

Low cost
Re-workable, but can’t take more than 2-5 rounds of reflow soldering before degradation
It is lead-free and can handle SMT components easily
It provides a coplanar surface, well suited for tight-pitch pads (BGA, QFP).

Disadvantages of OSP:

Not Good for PTH (Plated Through Holes)
Short Shelf Life, less than 6 month
Inspection is difficult as it is transparent and colorless
requires careful handling, as it’s susceptible to mechanical damage
OSP Surface Finish Process:

The OSP finishing process is composed of three major steps, including pre-cleaning and making the PCB board ready for smooth OSP coating application.


Blue Solder Mask OSP Coating PCB 4 Layer Printed Circuit Board 0

Blue Solder Mask OSP Coating PCB 4 Layer Printed Circuit Board 1



Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739