ENIG Dual Layer PCB 4mil Laminate Circuit Board Immersion Gold

Basic Information
Place of Origin: China
Certification: UL
Model Number: PCB0027
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 10 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
Place Of Origin:: Guangdong China Material:: FR4 TG>150
No Of Layers:: 2 Layer Solder Mask Colour:: Black
Surface Technics:: ENIG Min Lind Space&Width:: 4/4mil
High Light:

ENIG Dual Layer PCB


Immersion Gold Dual Layer PCB


4mil Laminate Circuit Board

Product Description

2 Layer PCB Printed Circuit Board Black Solder Mask Immersion Gold



  • Main Features:


1 2 Layer FR4 substrate material printed circuit board.

2 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated.

3 FR4 TG150 material, pcb thickness is 1.2mm.

4 Black solder mask and white silkscreen.

5 35um copper on each layer.

6 PCB size is 250mm*90mm/2pcs.

7 Surface treatment is immersion gold 1u'.

8 Customized pcb, need customer to send us the gerber file or pcb file.



  • S1150G Material Data Sheet:


Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 155
Td IPC-TM-650 5% wt. loss 380
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 36
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 TMA min >60
T288 IPC-TM-650 TMA min 30
Thermal Stress IPC-TM-650 288℃, solder dip -- pass
Volume Resistivity IPC-TM-650 After moisture resistance MΩ.cm 6.4 x 107
E-24/125 MΩ.cm 5.3 x 106
Surface Resistivity IPC-TM-650 After moisture resistance 4.8 x 107
E-24/125 2.8 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 140
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 45+kV NB
Dissipation Constant (Dk) IPC-TM-650 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 1MHz -- 0.01
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.4
125℃ N/mm 1.3
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 450
Water Absorption IPC-TM-650 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 0
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0



  • FAQ:


Q1: What is pcb stiffner?

A1: When working with flexible PCBs there are times when we need certain parts of the flexible printed circuit board to be rigid. We do so by adding mechanical support to parts of the PCB. This mechanical support is called a PCB Stiffener.

Flexible PCBs have many advantages like the capability to bend, twist, and fold. However, it is challenging to add/solder components and interconnects to these boards. A PCB Stiffener can be used to make a part of the board more stable/rigid so that it becomes easier to add/solder components or interconnects to the stiffer parts of the board. PCB stiffeners are usually not an integrated part of the PCB. They are only used to provide mechanical support to certain parts of the board.

Other advantages of PCB stiffeners include the reinforcing of solder joints, an increase in abrasion resistance and better handling of the board for automated pick-and-place component placement and soldering.

PCB stiffeners are usually made from FR4, Polyimide or aluminum. The thickness of FR-4 stiffeners varies from 0.003"(0.08 mm) to 0.125" (3.18 mm). The polyimide stiffeners are available with a thickness of 0.005" (125μm), 0.001" (25μm), 0.002" (50μm), and 0.003" (75μm). Polyimide stiffeners are usually a low-cost alternative to FR-4 as they are punched on a die instead of routed with a drill bit. To get better rigidity and heat sinking properties, aluminum stiffeners are used.

How are PCB Stiffeners Attached to Flexible PCBs?

There are two main methods to attached PCB Stiffeners to a flexible PCB - Thermal Bonding and Pressure-Sensitive Adhesives (PSA). The properties and differences of each approach have been highlighted in the table below:

Thermal Bonding Pressure Sensitive Adhesives (PSA)
Stiffeners are attached to the flex PCB by using heat and pressure Stiffeners are attached with the flex PCB by only using pressure
Stronger Bond Bong not as strong
Used in bonding in IPC class 3 product (Military application, Avionics etc.) Used in bonding in IPC class 2 product (TV, laptops, Consumer electronics etc.)
Higher Cost Lower Cost
Will cause significant damage to the circuit while removing from flex circuit. Usually removed without damaging circuit, if care is taken while removing.
Process take more time

Process takes less time

ENIG Dual Layer PCB 4mil Laminate Circuit Board Immersion Gold 0



Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739