|Place Of Origin::
|No Of Layers::
|Solder Mask Colour::
|Min Lind Space&Width::
FR4 Semi Flex PCB,
PI Semi Flex PCB,
Rigid Flex MultilayerPrinted Circuit Board
Rigid Flex printed circuit board multilayer pcb semi flex pcb green solder mask
1 Rigid flexible pcb, FR4 and polymide material laminated together.
2 8 Layer pcb, L1-L2 and L7-L8 are rigid layers. L3-L6 are flexible layers.
3 Finished pcb board size is 1.2mm.
4 Copper thickness is 1/1/H/H/H/H/1/1 OZ.
5 Min hole size is 0.2mm.
6 Min line space and width is 3/3mil.
7 Surface treatment is immersion gold 3u'.
8 The production cost will be higher than normal multilayer pcb and lead time will also be longer.
9 Min BGA size is 9mil.
Q1:What is ENIG Plating?
A1: ENIG (Electroless Nickel Immersion Gold) is a surface plating that is applied over the copper pads on a Printed Circuit Board to protect them from corrosion and other abnormalities. Initially, the copper pad is covered by a Nickel (Ni) layer followed by a thin immersion Gold (Au) layer. ENIG provides good oxidation resistance, excellent surface planarity and allows for easy soldering which results in excellent electrical performance of the PCB board.
ENIG is RoHS compliant and is, therefore, one of the most used PCB surface finishes even though it is more complex and expensive when compared to other PCB plating processes like HASL.
ENIG is a two-layer metallic coating – Nickle is the barrier to the copper pad and is also the material to which components are soldered. Gold on the other hand protects the Nickle during storage and also provides low contact resistance. Typical Nickle thickness varies from 4 – 7 µm and Gold thickness varies from 0.05 – 0 23 µm. ENIG requires a processing temperature of around 80 °C.
Advantages of ENIG Surface Finishes:
Limitations of ENIG Surface Finishes: