FR4 PI Circuit Board Rigid Flex Printed 10 Layer PCB

Basic Information
Place of Origin: China
Certification: UL
Model Number: Rigid-Flex PCB0002
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
Place Of Origin:: Guangdong China Material:: FR4+PI
No Of Layers:: 10 Layers Solder Mask Colour:: Blue
Surface Technics:: ENIG 2U' Min Lind Space&Width:: 3/3mil
Board Size: 180mm*120mm Min BGA Size: 9mil
High Light:

Rigid Flex PI Circuit Board


10 Layer PI Circuit Board


FR4 Circuit Board

Product Description

Rigid Flex Printed Circuit Board 10 Layer Pcb FR4 And PI Material Laminated



  • Main Features:


1 10 Layer rigid flex printed circuit board.

2  FR4 material and PI material laminated.

3  Finished pcb thickness is 1.0mm.

4  Blue solder mask and white legend.

5  Board size is 240mm*125mm/2pcs. 

6  Min hole size is 0.25mm.

7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated

8 Layer 4 to Layer 7 are flexible layers. Balance layers are rigid layers.

9 Surface treatment is immersion gold.



  • Our Production Capabilities:


NO Item Capability
1 Layer Count 1-24 Layers
2 Board Thickness 0.1mm-6.0mm
3 Finished Board Max Size 700mm*800mm
4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
5 Warp <0.7%
6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8 Drill Hole Diameter 0.1mm-6.5mm
9 Out Layer Copper Thickness 1/2OZ-8OZ
10 Inner Layer Copper Thickness 1/3OZ-6OZ
11 Aspect Ratio 10:1
12 PTH Hole Tolerance +/-3mil
13 NPTH Hole Tolerance +/-1mil
14 Copper Thickness of PTH Wall >10mil(25um)
15 Line Width And Space 2/2mil
16 Min Solder Mask Bridge 2.5mil
17 Solder Mask Alignment Tolerance +/-2mil
18 Dimension Tolerance +/-4mil
19 Max Gold Thickness 200u'(0.2mil)
20 Thermal Shock 288℃, 10s, 3 times
21 Impedance Control +/-10%
22 Test Capability PAD Size min 0.1mm
23 Min BGA 7mil
24 Surface Treatment

OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc





  • FAQ:


Q1: What is HASL - Hot Air Solder Leveling?



FR4 PI Circuit Board Rigid Flex Printed 10 Layer PCB 0

HASL (Hot Air Solder Leveling) is a metallic surface finishing technique, which is performed on the outermost layer of the PCB board to protect the exposed copper surfaces like tracks until the component placement and soldering is completed.

The HASL coating is composed of Solder with 63% Tin and 37% Lead, and during the assembly process, this coating gets dissolved with the soldering material.

FR4 PI Circuit Board Rigid Flex Printed 10 Layer PCB 1

The HASL Coating is applied as per the steps below:

  1. The process starts with the immersion of the PCB board into a molten tin/lead solution, where all exposed copper area is covered by this solution.
  2. After that, a Hot Air Leveler (HAL) ensures the uniformity of solder deposit by removing the excess solder from the PCB board, using high pressure hot air knives. The purpose of this is to leave a uniform and thin possible layer on the board.
  3. This coating protects the copper traces from corrosion until the board goes in for the assembly process.

FR4 PI Circuit Board Rigid Flex Printed 10 Layer PCB 2

Advantages of HASL:

  • Resistance to copper corrosion
  • Excellent wetting capability during the soldering process
  • Provides excellent quality solder joint (solderability) by making component soldering more effective
  • Economical
  • Can be re-worked easily
  • Suitable for Lead-free PCBs
  • Reduce the chances of PCB failure

Limitations of HASL:

  • It offers high thermal stress to the PCB, which results in defects.
  • Due to the inconsistent thickness of HASL coating, it’s not a feasible solution for SMT component placement.
  • Not suitable for PTH (Plated Through Hole) components.
  • Less environment-friendly

Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739