|Place Of Origin::||Guangdong China||Material::||FR4 TG>170|
|No Of Layers::||12 Layers||Solder Mask Colour::||Green|
|Surface Technics::||ENIG||Min Lind Space&Width::||3/3mil|
12 Layer Hybrid Multilayer PCB,
FR4 Hybrid Multilayer PCB,
High TG PCB
Multilayer Circuit Board 12 Layer PCB FR4 Material Hight TG Immserion Gold
Part NO: Multi-Layer PCB0001
Layer Count: 12 Layer HDI PCB
Finished Board Thickness: 1.6MM
Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H1
Min Lind Space&Width: 3/3mil
Application Area: Consumer Porducts
Outline Size: 230MM*95MM/1PCS
Outline tolerance: +/-0.13mm
Copper wall thickness for plated through holes: 25um
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
PCB report have to include the following information:
1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;
2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;
3 Other: date code, quantity etc.