|No Of Layers::||14 Layers||Solder Mask Colour::||Green|
|Material::||FR4 TG>170||Place Of Origin::||ShenZhen China|
|Surface Technics::||ENIG||Min Lind Space&Width::||3/3mil|
14 Layer Multilayer FR4 PCB,
Green Solder Multilayer FR4 PCB,
HDI Multilayer PCB
14 Layer PCB FR4 Material High Green Solder Mask 3 Mil Line Width
1 A 14 layer printed circuit board with finish board thickness at 2.0mm.
2 Solder mask in green color and white silkscreen.
3 Exposed copper pad surface to do immersion gold treatment.
4 All inner layer copper thickness is half OZ and outer layer copper thickness is 1OZ.
5 Copper wall thickness for plated through holes: 25um
6 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated
PCB report have to include the following information:
1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;
2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;
3 Other: date code, quantity etc.
X-OUT per panel:
1 X-OUT panel must be packed separately and marked clearly
2 A black X must be permanently marked on both sides of pcb
3 X-OUT per panel not be over 25%
4 X-OUT per lot not be over 5%