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20 Layer PCB Multilayer Circuit Board FR4 Material 2.5 / 2.5Mil Lind Space Width

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: Multi-Layer PCB0024
Minimum Order Quantity: 1 pcs/lot
Price: 3.0 usd/pcs
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 30 days
Payment Terms: T/T
Supply Ability: 50k pcs/month
Detail Information
No Of Layers:: 20 Layers Solder Mask Colour:: Green
Material:: FR4 TG>170 Place Of Origin:: ShenZhen China
Surface Technics:: ENIG 3U' Min Lind Space&Width:: 2.5/2.5mil
High Light:

2.5Mil Multilayer Circuit Board

,

FR4 Multilayer Circuit Board

,

OEM 20 Layer PCB


Product Description

Multilayer Circuit Board 20 Layer PCB FR4 Material 2.5/2.5Mil Lind Space&Width

 

 

PCB Specifications:

 

1 Part NO: Multi-Layer PCB0024

2 Layer Count: 20 Layer  PCB

3 Finished Board Thickness: 2.4MM

4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1

5 Min Lind Space&Width: 2.5/2.5mil

6 Application Area: Consumer Porducts

 

 

 

 

IR No : QCR Reference : Date:
PCB DESCRIPTION
C-dot Part Number of PCB  
Name of the PCB  
No of Layers : 20 Density Classification : E
PCB Size: Length   Breadth Unit Thickness
280 X 322.25 mm 2.4 mm
Panel Size: 290 X 322.25 mm 2.4 mm
Number of PCBs per Panel : 1
DESIGN & DRILL DATA
Input type : Gerber Files Qty 27
Input Code : ASCII  
Number Format : 2.4  
Units : Inches  
Zero Omit : Trailing  
Coordinates: Absolute  
Scale : 1:1  
DRC CHECKS FOR SIGNAL LAYERS  
Minimum Track width : Inner Layer 3.75 mils Outer Layer 5 mils  
Minimum Spacing between Tracks : Inner Layer 5 mils Outer Layer 5 mils  
Minimum Spacing between Pad & Track: Inner Layer 4 mils Outer Layer 5 mils  
Minimum PTH Size: 10 mils  
Minimum Annular Ring: 4 mils  
Minimum SMD Pitch: 19.685 mils  
FILM & GERBER DETAILS  
Description Films File Name Description Films File Name  
Drill DRL ABC00DRL.GBX Etch Layer 17 L17 ABC00L17.GBX  
Solder Paste Top SPT ABC00SPT.GBX Etch Layer 18 L18 ABC00L18.GBX  
Legend Top LGT ABC00LGT.GBX Etch Layer 19 L19 ABC00L19.GBX  
Solder Mask Top SMT ABC00SMT.GBX Etch Layer 20 L20 ABC00L20.GBX  
Etch Layer 1 L01 ABC00L01.GBX Etch Layer 21   L21.GBX  
Etch Layer 2 L02 ABC00L02.GBX Etch Layer 22   L22.GBX  
Etch Layer 3 L03 ABC00L03.GBX Etch Layer 23   L23.GBX  
Etch Layer 4 L04 ABC00L04.GBX Etch Layer 24   L24.GBX  
Etch Layer 5 L05 ABC00L05.GBX Etch Layer 25   L25.GBX  
Etch Layer 6 L06 ABC00L06.GBX Etch Layer 26   L26.GBX  
Etch Layer 7 L07 ABC00L07.GBX Etch Layer 27   L27.GBX  
Etch Layer 8 L08 ABC00L08.GBX Etch Layer 28   L28.GBX  
Etch Layer 9 L09 ABC00L09.GBX Etch Layer 29   L29.GBX  
Etch Layer 10 L10 ABC00L10.GBX Etch Layer 30   L30.GBX  
Etch Layer 11 L11 ABC00L11.GBX Solder Mask Bottom SMB ABC00SMB.GBX  
Etch Layer 12 L12 ABC00L12.GBX Legend Bottom LGB ABC00LGB.GBX  
Etch Layer 13 L13 ABC00L13.GBX Solder Paste Bottom SPB ABC00SPB.GBX  
Etch Layer 14 L14 ABC00L14.GBX NC Drill NCD ABC00_NCD.TAP  
Etch Layer 15 L15 ABC00L15.GBX NC Drill Tool Set NCT ABC00NCT.TXT  
Etch Layer 16 L16 ABC00L16.GBX Decode List   DCL.TXT  

 

 

MANUFACTURING DETAILS
Solder Mask Type : Photo Imageable
Minimum Solder Mask Clearance : 2.5 mils
Legend On (Side) : Both
Design Technology Mixed
Special Requirements :  

Controlled Impedance : Yes
No of Impedance layers : 8
Impedance Value : 50, 55, 90, 95 AND 100 OHMS

Back dril from Bottom : 7 Layers / Files

Back drill pin count : 156 pins

BGA Used
 
Base Material FR408HR
If base material is other than FR4 please
provide complete details of the material:
 
Surface Finish Electroless gold over nickel (ENIG)
Gold Plating required for Edge fingers
No of Edge Fingers/Total Area
(Specify , if the option is 'yes')
No
Nos/ Sq Inches
Automatic Copper Balancing Allowed Yes
Tear Drop Triangular to be added by the fabricator
Constructional Details Drawing No Layer stackup
MISCELLANEOUS DETAILS

The PCB 1. Has vias on pads filled with epoxy and plated with planner.2. Has back-drill vias filled with epoxy 3. Has ENIG surface finish. 4. Five Back drill NCD files attached 5. Depanalizing pcb by slot cut.

Back drill layers:

1.Bottom to Layer19,

2.Bottom to Layer17,

3.Bottom to Layer15,

4.Bottom to Layer10,

5.Bottom to Layer08,

6.Bottom to Layer06,

7.Bottom to Layer04.

APPROVALS
Designer Name Approved by

 

 

 

 

Layer Stackup:

 

Layer No. Layer Type Di-electric (Prepreg/ Core)

Di-electric

constant

Processed Thickness

(mil)

Target Impedance - Single Ended

(+/- 10%)

Trace Width (Single ended)

(mil)

Target Impedance – differential

(+/- 10%)

Trace Width/ separation (differential pair)

(mil)

    MASK 4.0 2.0        
1 TOP

Copper Foil 12 microns

 

  1.772

50 ohm

55 ohm

7

6

100ohm

95ohm

90ohm

5-8-5

5-6.5-5

5-5.5-5

    PrepreG 3.23 2.101        
    PrepreG 3.23 2.101        
2 GND Copper   0.689        
    CORE 3.37 3.9        
3 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
4 GND Copper   0.689        
    CORE 3.37 3.9        
5 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
6 GND Copper   0.689        
    CORE 3.37 3.9        
7 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
8 GND Copper   0.689        
    CORE 3.37 3.9        
9 POWER Copper   2.638        
    PrepreG 3.23 0.788        
    PrepreG 3.23 0.788        
10 GND Copper   2.638        
    core 3.37 3.9        
11 POWER Copper   2.638        
    PrepreG 3.23 0.788        
    PrepreG 3.23 0.788        
12 POWER Copper   2.638        
    core 3.37 3.9        
13 GND Copper   0.689        
    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
14 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    CORE 3.37 3.9        
15 GND Copper   0.689        
    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
16 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    CORE 3.37 3.9        
17 GND Copper   0.689        
    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
18 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    CORE 3.37 3.9        
19 GND Copper   0.689        
    PrepreG 3.23 2.101        
    PrepreG 3.23 2.101        
20 SOLDER

Copper Foil 12 microns

 

  1.772

50 ohm

55 ohm

7

6

100ohm

95ohm

90ohm

5-8-5

5-6.5-5

5-5.5-5

    MASK   2.0        

 

 

 

 

 

 

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