| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | 16LayerPCB0034 |
| Minimum Order Quantity: | 1pcs/lot |
| Price: | negotiable |
| Packaging Details: | Vacuum package in bubble wrap |
| Delivery Time: | 30 days |
| Payment Terms: | T/T |
| Supply Ability: | 10kpcs/Month |
| Layer Count: | 16 Layer | Material: | FR4 TG180 |
|---|---|---|---|
| Board Thickness: | 5.0MM | Drawing Size: | 50mm*23mm |
| Copper Thickness: | 1 OZ On Each Layer | Surface Treatment: | Immersion Gold 2U' |
| High Light: | FR4 16 Layer PCB,Substrate 16 Layer PCB,94vo printed circuit board |
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Printed Circuit Boards 16 Layer Super Thick FR4 Substrate 5.0MM Board Thickness
Main Features:
1 16 Layer PCB made from FR4 Material, high TG FR4, TG180, which has high stability.
2 The PCB is customized product. It was produced according to customoer's gerber design and requirement.
3 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated
4 The surface treatment is immersion gold and gold thickness is 2u'.
5 Need to use high TG prepreg during lamination, TG 180 Prepreg.
6 Used in industrial control area.
Our Product Ranges:
| Our Product Categories | ||
| Material Kinds | Layer Counts | Treatments |
| FR4 | Single Layer | HASL Lead Free |
| CEM-1 | 2 Layer/Double Layer | OSP |
| CEM-3 | 4 Layer | Immersion Gold/ENIG |
| Aluminum Substrate | 6 Layer | Hard Gold Plating |
| Iron Substrate | 8 Layer | Immersion Silver |
| PTFE | 10 Layer | Immersion Tin |
| PI Polymide | 12 Layer | Gold fingers |
| AL2O3 Ceramic Substrate | 14 Layer | Heavy copper up to 8OZ |
| Rogers, Isola high frequency materials | 16 Layer | Half plating holes |
| Halogen free | 18 Layer | HDI Laser drilling |
| Copper based | 20 Layer | Selective immersion gold |
| 22 Layer | immersion gold +OSP | |
| 24 Layer | Resin filled in vias | |
PCB report have to include the following information:
1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;
2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;
3 Other: date code, quantity etc.
