| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | PCB000371 |
| Minimum Order Quantity: | 1pcs/lot |
| Price: | negotiable |
| Packaging Details: | Vacuum package in bubble wrap |
| Delivery Time: | 15 days |
| Payment Terms: | T/T |
| Supply Ability: | 100kpcs/Month |
| Layer Count: | 6 Layer | Material: | FR4 TG150 |
|---|---|---|---|
| Legend Color: | White Silkscreen | Min BGA Size: | 9 Mil |
| Min Trace: | 3.5 Mil | Finished Thickness: | 0.8 MM |
| High Light: | 94V0 multi layer board,multi layer board substrate,fr4 pcb board |
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Printed Circuit Boards 6 Layer PCB 94V-0 FR4 Substrate Material
PCB Specifications:
1 All dimensions are in MM.
2 Fabricate per IPC-6012A Class2.
3 Materials:
3.1 Dielectric: FR4 Per IPC or equivalent
3.2 Min Tg: 170DEG
3.3 Copper: As per stack up
3.4 UL Rating: 94V0 Minimum
4 Surface finish: ENIG
5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.
6 Editing of existing copper layers shall require customer approval.
7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.
8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side.
9 Vendor to mark date code and logo in legend secondary side.
10 Bow and twist shall not exceed 1.0% of longest side.
11 Vendor to provide panel drawing for customer approval before production.
Our Product Ranges:
| Our Product Categories | ||
| Material Kinds | Layer Counts | Treatments |
| FR4 | Single Layer | HASL Lead Free |
| CEM-1 | 2 Layer/Double Layer | OSP |
| CEM-3 | 4 Layer | Immersion Gold/ENIG |
| Aluminum Substrate | 6 Layer | Hard Gold Plating |
| Iron Substrate | 8 Layer | Immersion Silver |
| PTFE | 10 Layer | Immersion Tin |
| PI Polymide | 12 Layer | Gold fingers |
| AL2O3 Ceramic Substrate | 14 Layer | Heavy copper up to 8OZ |
| Rogers, Isola high frequency materials | 16 Layer | Half plating holes |
| Halogen free | 18 Layer | HDI Laser drilling |
| Copper based | 20 Layer | Selective immersion gold |
| 22 Layer | immersion gold +OSP | |
| 24 Layer | Resin filled in vias | |
Multilayer PCB Process:
