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1 OZ Copper Aluminum Base PCB Circuit Boards 10 Layer 12 Mil

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: PCB000371
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: Vacuum package in bubble wrap
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Layer Count: 10 Layer Copper Thickness: 1 OZ On Each Layer
Drawing File Format: Gerber Or PCB Min BGA Size: 12 Mil
Min Trace: 3.1 Mil Finished Thickness: 1.0 MM
High Light:

12 mil Aluminum Base PCB

,

10 Layer Aluminum Base PCB

,

1 OZ Copper PCB


Product Description

Printed Circuit Boards 10 Layer PCB With 1 OZ Copper On Each Layer

 

 

PCB Specifications:

 

1 All dimensions are in MM.

2 Fabricate per IPC-6012A Class2.

3 Materials:

3.1 Dielectric: FR4 Per IPC or equivalent

3.2 Min Tg: 170DEG

3.3 Copper: As per stack up

3.4 UL Rating: 94V0 Minimum

4 Surface finish: ENIG

5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.

6 Editing of existing copper layers shall require customer approval.

7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.

8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side.

9 Vendor to mark date code and logo in legend secondary side.

10 Bow and twist shall not exceed 1.0% of longest side.

11 Vendor to provide panel drawing for customer approval before production.

 

 

S1130 Data Sheet:

 

S1130
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 135
Td IPC-TM-650 2.4.24.6 5% wt. loss 310
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 65
After Tg ppm/℃ 310
50-260℃ % 4.5
T260 IPC-TM-650 2.4.24.1 TMA min 13
T288 IPC-TM-650 2.4.24.1 TMA min <1
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 60S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 4.8E + 08
E-24/125 MΩ.cm 4.6E + 06
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 5.2E + 07
E-24/125 5.3E + 06
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 120
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 60
Electrical Strength IPC-TM-650 2.5.6.2 D-48/50+D-4/23 kV/mm
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.6
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.016
IEC 61189-2-721 10GHz --
Peel Strength(1oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.8
125℃ N/mm 1.6
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 500
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.15
CTI IEC30112 C-48/23/50, PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

Multilayer PCB Process:

 

1 OZ Copper Aluminum Base PCB Circuit Boards 10 Layer 12 Mil 0

Contact Details
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Phone Number : +8613826589739

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