| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | PCB000379 |
| Minimum Order Quantity: | 1pcs/lot |
| Price: | negotiable |
| Packaging Details: | Vacuum package in bubble wrap |
| Delivery Time: | 23 days |
| Payment Terms: | T/T |
| Supply Ability: | 100kpcs/Month |
| Layer Count: | 10 Layer | Solder Mask: | Green Solder Mask |
|---|---|---|---|
| Min Hole Diameter: | 0.2 MM | PTH Wall Thickness: | 25 UM |
| Lead Time: | 23 Days | Finished Thickness: | 2.0 MM |
| High Light: | 25UM PTH Printed Circuit Boards,Printed Circuit Boards 10 Layer,Multilayer FR4 PCB |
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Printed Circuit Boards 10 Layer PCB High TG Degree FR4 Material
Specifications:
1 All dimensions are in MM.
2 Fabricate per IPC-6012A Class2.
3 Materials:
3.1 Dielectric: FR4 Per IPC or equivalent
3.2 Min Tg: 170DEG
3.3 Copper: As per stack up
3.4 UL Rating: 94V0 Minimum
4 Surface finish: ENIG
5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.
6 Editing of existing copper layers shall require customer approval.
7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.
8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side.
9 Vendor to mark date code and logo in legend secondary side.
10 Bow and twist shall not exceed 1.0% of longest side.
11 Vendor to provide panel drawing for customer approval before production
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
FQA:
Q1: What is Solder Flux? Why do we use it?
A1: Solder Flux is a chemical cleaning agent used when soldering electronic components onto printed circuit boards. It is used in both manual hand-soldering as well as the different automated soldering processes used by PCB contract manufacturers.
Printed Circuit boards usually have copper traces which can oxidize when exposed to air or get contaminated while handling the board. This can prevent the formation of good solder joints. In order to remove this contamination and avoid oxidization, it is crucial that the board is cleaned with flux prior to soldering. Flux can be used to clean and remove these oxides and other impurities from the board.
Physically, Solder flux can be solid, semi-solid, or a liquid. It is usually available as a paste in jars/tin/cans. It is also available as a liquid in bottles. Flux-pens are generally used to apply flux when hand soldering.
Most often, a solder flux is available as an adhesive-like chemical compound nature and is responsible for holding the components in place until the reflow process. The flux also protects the metal surfaces from re-oxidation during soldering. The flux contains additives to improve the flow characteristics of the molten solder and thus helps in wetting of the board.
Categories of Flux
According to the electronics industry standards, J-STD-004, solder flux can be classified into 3 major categories based on its composition, activity (strength), the presence or lack of halide activators.
1. Rosin and Rosin Substitutes: Rosin flux is the oldest and still one of the most common fluxes used for electrical components. These fluxes are derived from a pine tree extract. Rosin flux is nearly inert at room temperature, gets active only when heated.
2. Water Soluble, or Organic acid flux: Organic acid flux is water soluble and can be cleaned with water, and hence the name. these fluxes are most commonly used for soldering electrical circuits. It cleans oxidation on electrical leads very quickly.
3. No-Clean: these fluxes are made with resins and various levels of solid residues. According to the name, these fluxes require little or no cleaning.
How is Flux Applied?
Solder flux can be applied on the board in a number of ways based on the soldering process being used.
Manual hand-soldering: Solder flux can be applied manually using a solder pen or in many cases flux is not mixed within the solder wire or solder bar. If the flux is mixed inside the solder, then simply heating the wire onto the surface with soldering iron is adequate. Alternatively, flux can be evenly spread on the surface of the board before applying the solder.
Wave Soldering: In this case, the flux is sprayed on the board prior to it going through the solder wave. Once in place, the flux cleans the components that are to be soldered. This removes any oxide layers that have formed. If the board is using a more corrosive type of flux, then the board will have to go through a pre-cleaning before the flux is applied.
Reflow Soldering: Solder flux used for the solder reflow process, is a paste composed of a sticky flux and small spheres of metal solder. Solder paste is a combination of a powder made up of metal solder particles and sticky flux that has the consistency of putty. They are generally mixed as a 50/50 ratio.
Here, the flux not only does its usual job of cleaning the soldering surfaces of impurities and oxidation, but it also provides a temporary adhesive that holds the surface mount components in place.
Selective Soldering: The flux is applied either by spraying it, or by using a more precise drop jet process. The precise drop-jet process is the application of flux to target locations without overspray.
