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16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: Multi-Layer PCB0025
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 30 days
Payment Terms: T/T
Supply Ability: 20k pcs/month
Detail Information
No Of Layers:: 16 Layers Silkscreen: White
PTH Wall Copper: 25 UM Finished Thickness: 2.0 MM
Surface Technics:: ENIG 2U' Min Lind Space&Width:: 3/3 Mil
High Light:

16 Layer Multilayer Circuit Board

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2.0 MM Multilayer Circuit Board

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multilayer pcb board


Product Description

Multilayer Circuit Board 16 Layer PCB 2.0 MM Thickness

 

 

PCB Specifications:

 

1 Part NO: Multi-Layer PCB0025

2 Layer Count: 16 Layer  PCB

3 Finished Board Thickness: 2.0MM

4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1

5 Min Lind Space&Width: 3/3mil

6 Application Area: Industrial Control

 


Material Data Sheet:

 

S1130
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 135
Td IPC-TM-650 2.4.24.6 5% wt. loss 310
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 65
After Tg ppm/℃ 310
50-260℃ % 4.5
T260 IPC-TM-650 2.4.24.1 TMA min 13
T288 IPC-TM-650 2.4.24.1 TMA min <1
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 60S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 4.8E + 08
E-24/125 MΩ.cm 4.6E + 06
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 5.2E + 07
E-24/125 5.3E + 06
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 120
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 60
Electrical Strength IPC-TM-650 2.5.6.2 D-48/50+D-4/23 kV/mm
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.6
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.016
IEC 61189-2-721 10GHz --
Peel Strength(1oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.8
125℃ N/mm 1.6
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 500
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.15
CTI IEC30112 C-48/23/50, PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

Layer Stackup:

 

Layer No. Layer Type Di-electric (Prepreg/ Core)

Di-electric

constant

Processed Thickness

(mil)

Target Impedance - Single Ended

(+/- 10%)

Trace Width (Single ended)

(mil)

Target Impedance – differential

(+/- 10%)

Trace Width/ separation (differential pair)

(mil)

    MASK 4.0 2.0        
1 TOP

Copper Foil 12 microns

 

  1.772

50 ohm

55 ohm

7

6

100ohm

95ohm

90ohm

5-8-5

5-6.5-5

5-5.5-5

    PrepreG 3.23 2.101        
    PrepreG 3.23 2.101        
2 GND Copper   0.689        
    CORE 3.37 3.9        
3 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
4 GND Copper   0.689        
    CORE 3.37 3.9        
5 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
6 GND Copper   0.689        
    CORE 3.37 3.9        
7 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
8 GND Copper   0.689        
    CORE 3.37 3.9        
9 POWER Copper   2.638        
    PrepreG 3.23 0.788        
    PrepreG 3.23 0.788        
10 GND Copper   2.638        
    core 3.37 3.9        
11 POWER Copper   2.638        
    PrepreG 3.23 0.788        
    PrepreG 3.23 0.788        
12 POWER Copper   2.638        
    core 3.37 3.9        
13 GND Copper   0.689        
    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
14 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    CORE 3.37 3.9        
15 GND Copper   0.689        
    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
16 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    CORE 3.37 3.9        
17 GND Copper   0.689        
    PrepreG 3.23 1.86        
    PrepreG 3.23 1.86        
18 SIGNAL Copper   0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4

    CORE 3.37 3.9        
19 GND Copper   0.689        
    PrepreG 3.23 2.101        
    PrepreG 3.23 2.101        
20 SOLDER

Copper Foil 12 microns

 

  1.772

50 ohm

55 ohm

7

6

100ohm

95ohm

90ohm

5-8-5

5-6.5-5

5-5.5-5

    MASK   2.0        

 

 

 

 

 

 

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