| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | Half hole PCB0005 |
| Minimum Order Quantity: | 1 pcs/lot |
| Price: | negotiable |
| Packaging Details: | Vacuum bubble bag packaging |
| Delivery Time: | 20 days |
| Payment Terms: | T/T |
| Supply Ability: | 100k pcs/month |
| Place Of Origin:: | Guangdong China | Material:: | FR4 TG>170 |
|---|---|---|---|
| No Of Layers:: | 6 Layer | Solder Mask Colour:: | Green |
| Min BAG Pad: | 8.5 Mil | Min Lind Space&Width:: | 3/3mil |
| High Light: | 1.6 MM PCB Electronic Board,FR4 Substrate pcb electronic board,6 Layer PCB GPS Module |
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Half Hole PCB FR4 Substrate 6 Layer PCB GPS Modole Used 1.6 MM Thickness
Requirements:
1 All dimensions are in MM.
2 Fabricate per IPC-6012A Class2.
3 Materials:
3.1 Dielectric: FR4 Per IPC or equivalent
3.2 Min Tg: 170DEG
3.3 Copper: As per stack up
3.4 UL Rating: 94V0 Minimum
4 Surface finish: ENIG
5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.
6 Editing of existing copper layers shall require customer approval.
7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.
Layer Stackup:
| S1000-2 | |||||
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 220 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 5 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 100S No Delamination | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.2 x 108 | |
| E-24/125 | MΩ.cm | 4.5 x 106 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 7.9 x 107 | |
| E-24/125 | MΩ | 1.7 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.013 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.38 | |||
| 125℃ | N/mm | 1.07 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
