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KB6165 Material Half Hole PCB Circuit Card Assemblies 4 Layer 1.0 MM

Basic Information
Place of Origin: China
Certification: UL
Model Number: Half hole PCB0015
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
PCB Kind: 4 Layer PCB Material:: FR4 TG130
Material Brand: KB6165 PCB Thickness:: 1.0 MM
Solder Mask: Black Min Lind Space&Width:: 4/4 Mil
High Light:



KB6165 Half Hole PCB


1.0 MM circuit card assemblies

Product Description

4 Layer Half Hole PCB KB6165 Material 1.0 MM Thickness



Board Info:


1 Part NO: Half hole PCB0015

2 Layer Count: 4 Layer PCB

3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM

4 Solder Mask: Black 

5 Min Lind Space&Width: 4/4 mil

6 Application Area: Blue-tooth Module


7 Drillings:  L1-L4 0.2MM Mechanical Drilling


8 PCB Size: 100mm*60mm/21pcs




Packing Specifications:


1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.



X-OUT per panel:


1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%


Our Capabilities:


NO Item Capability
1 Layer Count 1-24 Layers
2 Board Thickness 0.1mm-6.0mm
3 Finished Board Max Size 700mm*800mm
4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
5 Warp <0.7%
6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8 Drill Hole Diameter 0.1mm-6.5mm
9 Out Layer Copper Thickness 1/2OZ-8OZ
10 Inner Layer Copper Thickness 1/3OZ-6OZ
11 Aspect Ratio 10:1
12 PTH Hole Tolerance +/-3mil
13 NPTH Hole Tolerance +/-1mil
14 Copper Thickness of PTH Wall >10mil(25um)
15 Line Width And Space 2/2mil
16 Min Solder Mask Bridge 2.5mil
17 Solder Mask Alignment Tolerance +/-2mil
18 Dimension Tolerance +/-4mil
19 Max Gold Thickness 200u'(0.2mil)
20 Thermal Shock 288℃, 10s, 3 times
21 Impedance Control +/-10%
22 Test Capability PAD Size min 0.1mm
23 Min BGA 7mil
24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739