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S1150G Half Hole PCB 4 Layer Electronic Printed Circuit Board 1.0 MM

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: Half hole PCB0018
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
PCB Kind: 4 Layer PCB Material:: FR4 TG150
Material Brand: S1150G PCB Thickness:: 1.0 MM
Solder Mask: Green Solder Mask Min Lind Space&Width:: 3/3.9 Mil
High Light:

S1150G Half Hole PCB

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Half Hole PCB 4 Layer

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1.0 MM Electronic Printed Circuit Board


Product Description

4 Layer Half Hole PCB S1150G Material 1.0 MM Thickness

 

 

Board Info:

 

1 Part NO: Half hole PCB0018


2 Layer Count: 4 Layer PCB


3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM


4 Solder Mask: Black 


5 Min Lind Space&Width: 4/4 mil


6 Application Area: Blue-tooth Module

 

7 Drillings:  L1-L2 0.1MM, L2-L3 0.15MM, L3-L4 0.1MM, L1-L4 0.2MM Mechanical Drilling

 

8 PCB Size: 111.95mm*101.93mm/25pcs

 

9 Material: S1150G

 

 

Packing Specifications:

 

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.

 

 

X-OUT per panel:

 

1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%

 

 

Material Data Sheet:

 

 

S1150G
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 155
Td IPC-TM-650 2.4.24.6 5% wt. loss 380
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 36
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- pass
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 6.4 x 107
E-24/125 MΩ.cm 5.3 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 4.8 x 107
E-24/125 2.8 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 140
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 45+kV NB
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.01
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.4
125℃ N/mm 1.3
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 450
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 0
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

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