1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate

Basic Information
Place of Origin: China
Certification: UL
Model Number: HDIPCB0005
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 25 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Layer Count: 10 Layer PCB Kind: HDI PCB
Board Thickness: 1.0MM Min Hole: 0.1MM
Copper Thickness: 1/H/H/H/H/H/H/H/H/1 Surface Treatment: Immersion Gold 2U'
Material: IT 180A BGA Size: 10 MIL
High Light:

1.0MM Thickness High Density Circuit Board


FR4 Substrate high density circuit board


HDI Multilayer Rigid Flex Pcb

Product Description

HDI PCB 10 Layer 1.0MM Thickness Immersion Gold 2U' FR4 Substrate



PCB Specifications:  


1 Part NO: HDIPCB0005

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.0MM

4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM,

                        L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM

5 Min Lind Space&Width: 3/3mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Optical Module




Our production applications:


1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.



IT180A Data Sheet:



Items IPC TM-650 Typical Value Unit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.8 5
Volume Resistivity 1x109 M-cm
Surface Resistivity 1x108 M
Moisture Absorption, maximum 0.10 %
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4 500-530
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched Pass Pass Rating
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.24 45
ppm/˚C ppm/˚C
Thermal Resistance
A. T260
B. T288 >60
Minutes Minutes






Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739