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1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: HDIPCB0005
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 25 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Layer Count: 10 Layer PCB Kind: HDI PCB
Board Thickness: 1.0MM Min Hole: 0.1MM
Copper Thickness: 1/H/H/H/H/H/H/H/H/1 Surface Treatment: Immersion Gold 2U'
Material: IT 180A BGA Size: 10 MIL
High Light:

1.0MM Thickness High Density Circuit Board

,

FR4 Substrate high density circuit board

,

HDI Multilayer Rigid Flex Pcb


Product Description

HDI PCB 10 Layer 1.0MM Thickness Immersion Gold 2U' FR4 Substrate

 

 

PCB Specifications:  

 

1 Part NO: HDIPCB0005

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.0MM

4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM,

                        L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM

5 Min Lind Space&Width: 3/3mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Optical Module

 

 

 

Our production applications:

 

1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

 

 

IT180A Data Sheet:

 

 

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.8 5
8
lb/inch
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.10 %
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
4.5
4.4
--
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
0.014
0.015
--
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4 500-530
410-440
N/mm2
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched
2.4.13.1 Pass Pass Rating
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.24 45
210
2.7
ppm/˚C ppm/˚C
%
Thermal Resistance
A. T260
B. T288
2.4.24.1 >60
20
Minutes Minutes

 

 

 

 

 

Contact Details
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Phone Number : +8613826589739

WhatsApp : +008613826589739