| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | HDIPCB0005 |
| Minimum Order Quantity: | 1pcs/lot |
| Price: | negotiable |
| Packaging Details: | vacuum package in bubble wrap |
| Delivery Time: | 25 days |
| Payment Terms: | T/T |
| Supply Ability: | 100kpcs/Month |
| Layer Count: | 10 Layer | PCB Kind: | HDI PCB |
|---|---|---|---|
| Board Thickness: | 1.0MM | Min Hole: | 0.1MM |
| Copper Thickness: | 1/H/H/H/H/H/H/H/H/1 | Surface Treatment: | Immersion Gold 2U' |
| Material: | IT 180A | BGA Size: | 10 MIL |
| High Light: | 1.0MM Thickness High Density Circuit Board,FR4 Substrate high density circuit board,HDI Multilayer Rigid Flex Pcb |
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HDI PCB 10 Layer 1.0MM Thickness Immersion Gold 2U' FR4 Substrate
PCB Specifications:
1 Part NO: HDIPCB0005
2 Layer Count: 10 Layer HDI PCB
3 Finished Board Thickness: 1.0MM
4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM,
L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM
5 Min Lind Space&Width: 3/3mil
6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1
7 Application Area: Optical Module
Our production applications:
1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.
2 Industrial control:main boards in machines, industrial robots, servo motors etc.
3 Automotive: BMS main boards, automotive radar etc.
4 Power supplies: UPS, industrial power supply, frequency power supply.
5 Medical: medical equipment, medical equipment power supply.
6 Communication products: 5G base station, routers, satellites, antennas.
IT180A Data Sheet:
| Items | IPC TM-650 | Typical Value | Unit |
| Peel Strength, minimum A. Low profile copper foil B. Standard profile copper foil |
2.4.8 | 5 8 |
lb/inch |
| Volume Resistivity | 2.5.17.1 | 1x109 | M-cm |
| Surface Resistivity | 2.5.17.1 | 1x108 | M |
| Moisture Absorption, maximum | 2.6.2.1 | 0.10 | % |
| Permittivity (Dk, 50% resin content) A. 1MHz B. 1GHz |
2.5.5.9 2.5.5.9 |
4.5 4.4 |
-- |
| Loss Tangent (Df, 50% resin content) A. 1MHz B. 1GHz |
2.5.5.9 2.5.5.9 |
0.014 0.015 |
-- |
| Flexural Strength, minimum A. Length direction B. Cross direction |
2.4.4 | 500-530 410-440 |
N/mm2 |
| Thermal Stress 10 s at 288°C A. Unetched B. Etched |
2.4.13.1 | Pass Pass | Rating |
| Flammability | UL94 | V-0 | Rating |
| Comparative Tracking Index (CTI) | IEC 60112 / UL 746 | CTI 3 (175-249) | Class (Volts) |
| Glass Transition Temperature(DSC) | 2.4.25 | 175 | ˚C |
| Decomposition Temperature | 2.4.24.6 | 345 | ˚C |
| X/Y Axis CTE (40℃ to 125℃) | 2.4.41 | 11-13 / 13-15 | ppm/˚C |
| Z-Axis CTE A. Alpha 1 B. Alpha 2 C. 50 to 260 Degrees C |
2.4.24 | 45 210 2.7 |
ppm/˚C ppm/˚C % |
| Thermal Resistance A. T260 B. T288 |
2.4.24.1 | >60 20 |
Minutes Minutes |
