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HDI Electric Circuit Board PCB 4 Layer Blue Solder Mask Immersion Gold Enig

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: HDIPCB0006
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 25 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Layer Count: 4 Layer PCB Kind: HDI PCB
Board Thickness: 1.6 MM Min Hole: 0.1MM
Solder Mask: Blue Solder Mask Surface Treatment: Immersion Gold 2U'
Material: S1150G BGA Size: 10 MIL
High Light:

HDI Electric Circuit Board

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Blue Solder Electric Circuit Board

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immersion gold enig


Product Description

HDI PCB 4 Layer Blue Solder Mask Immersion Gold Treatment 1.6 MM Thickness

 

 

PCB Specifications:  

 

1 Part NO: HDIPCB0006

2 Layer Count: 4 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 Hole Structure:  L1-L2 0.1MM, L2-L3 0.2MM, L3-L4 0.1MM

5 Min Lind Space&Width: 4/4mil

6 Copper Thickness: 1/H/H/1

7 Application Area: WIFI Module

 

 

 

Our production applications:

 

1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

 

 

S1150G Data Sheet: 

 

S1150G
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 155
Td IPC-TM-650 2.4.24.6 5% wt. loss 380
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 36
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- pass
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 6.4 x 107
E-24/125 MΩ.cm 5.3 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 4.8 x 107
E-24/125 2.8 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 140
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 45+kV NB
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.01
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.4
125℃ N/mm 1.3
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 450
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 0
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

 

 

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