| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | HDIPCB0006 |
| Minimum Order Quantity: | 1pcs/lot |
| Price: | negotiable |
| Packaging Details: | vacuum package in bubble wrap |
| Delivery Time: | 25 days |
| Payment Terms: | T/T |
| Supply Ability: | 100kpcs/Month |
| Layer Count: | 4 Layer | PCB Kind: | HDI PCB |
|---|---|---|---|
| Board Thickness: | 1.6 MM | Min Hole: | 0.1MM |
| Solder Mask: | Blue Solder Mask | Surface Treatment: | Immersion Gold 2U' |
| Material: | S1150G | BGA Size: | 10 MIL |
| High Light: | HDI Electric Circuit Board,Blue Solder Electric Circuit Board,immersion gold enig |
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HDI PCB 4 Layer Blue Solder Mask Immersion Gold Treatment 1.6 MM Thickness
PCB Specifications:
1 Part NO: HDIPCB0006
2 Layer Count: 4 Layer HDI PCB
3 Finished Board Thickness: 1.6MM
4 Hole Structure: L1-L2 0.1MM, L2-L3 0.2MM, L3-L4 0.1MM
5 Min Lind Space&Width: 4/4mil
6 Copper Thickness: 1/H/H/1
7 Application Area: WIFI Module
Our production applications:
1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.
2 Industrial control:main boards in machines, industrial robots, servo motors etc.
3 Automotive: BMS main boards, automotive radar etc.
4 Power supplies: UPS, industrial power supply, frequency power supply.
5 Medical: medical equipment, medical equipment power supply.
6 Communication products: 5G base station, routers, satellites, antennas.
S1150G Data Sheet:
| S1150G | |||||
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 155 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 380 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 36 | |
| After Tg | ppm/℃ | 220 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | pass | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 6.4 x 107 | |
| E-24/125 | MΩ.cm | 5.3 x 106 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 4.8 x 107 | |
| E-24/125 | MΩ | 2.8 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 140 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.01 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.4 | |||
| 125℃ | N/mm | 1.3 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 600 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| CTI | IEC60112 | A | Rating | PLC 0 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
