products

8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: HDIPCB0007
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers:: 8 Layer Material:: FR4 TG>180
Solder Mask Colour:: Black Place Of Origin:: ShenZhen China
Surface Technics:: Immersion Gold 2U' Min Lind Space&Width:: 2.5/2.5mil
High Light:

Black Solder HDI Printed Circuit Boards

,

8 LayerHDI Printed Circuit Boards

,

Interconnected High Density PCB


Product Description

HDI PCB High Density Interconnected 8 Layer Black Solder Mask

 

 

Main Features: 

 

1 8 Layer HDI PCB, high density printed circuit board.

2  Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM, L7-L8 0.1MM

3  Buried holes: L4-L7 0.2MM.

4  Via holes: L1-L8 0.2MM.

5  PCB thickness is 1.0mm.

6  Min BGA ball size is 10mil.

7  Min line space and width is 2.5/2.5mil.

8  Material is FR4 Substrate, tg180 degree

9  S1000-2 material used.

 

 

S1000-2 Material data sheet:

 

 

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4 DMA 185
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

Packing Specifications:

 

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.

 

 

 

Contact Details
admin

Phone Number : +8613826589739

WhatsApp : +008613826589739