100 Ohm HDI PCB 10 Layer 10 MIL 1.6 MM FR4 TG170 Material

Basic Information
Place of Origin: China
Certification: UL
Model Number: HDIPCB0009
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 25 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Layer Count: 10 Layer Solder Mask: Green Solder Mask
Board Thickness: 1.6MM Min Hole: 0.1MM
Copper Thickness: 1/H/H/H/H/H/H/H/H/1 Surface Treatment: Immersion Gold 2U'
Impedance Control: 100 Ohm BGA Size: 10 MIL
High Light:

100 Ohm HDI PCB




tg170 pcb material

Product Description

HDI PCB 10 Layer 1.6 MM Thickness FR4 TG170 Material


PCB Specifications:  


1 Part NO: HDIPCB0009

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 Drilling: L1-L2 0.1MM, L3-L8 0.2MM, L9-L10 0.1MM, L1-L10 0.2MM

5 Min Lind Space&Width: 4/6mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Automobiles




Our production applications:


1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.



Our Product Categories:


Our Product Categories
Material Kinds Layer Counts Treatments
FR4 Single Layer HASL Lead Free
CEM-1 2 Layer/Double Layer OSP
CEM-3 4 Layer Immersion Gold/ENIG
Aluminum Substrate 6 Layer Hard Gold Plating
Iron Substrate 8 Layer Immersion Silver
PTFE 10 Layer Immersion Tin
PI Polymide 12 Layer Gold fingers
AL2O3 Ceramic Substrate 14 Layer Heavy copper up to 8OZ
Rogers, Isola high frequency materials 16 Layer Half plating holes
Halogen free 18 Layer HDI Laser drilling
Copper based 20 Layer Selective immersion gold
  22 Layer immersion gold +OSP
  24 Layer Resin filled in vias



Packing Specifications:


1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.








Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739