| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | HDIPCB0010 |
| Minimum Order Quantity: | 1pcs/lot |
| Price: | negotiable |
| Packaging Details: | vacuum package in bubble wrap |
| Delivery Time: | 15-20 days |
| Payment Terms: | T/T |
| Supply Ability: | 100kpcs/Month |
| Material: | FR4 | Layer Count: | 8 Layer |
|---|---|---|---|
| Solder Mask: | Green Solder Mask | Board Thickness: | 1.6MM |
| Min Hole: | 0.1MM | Min Lind Space And Width: | 3.5/3.5MIL |
| Surface Treatment: | Immersion Gold 2U' | Size: | 120MM*112MM/20PCS |
| High Light: | Immersion Gold HDI PCB,8 Layer HDI PCB,Epoxy Resin Circuit Boards |
||
8Layer HDI PCB 1.6 MM Thickness Epoxy Filled In Vias
Main Features:
1 8 Layer HDI PCB with blind and buried holes.
2 Green solder mask and immersion gold treatment.
3 Min hole size is 0.1mm and min BGA size is 11.8mil.
4 Finished board thickness is 1.6mm.
5 The production cost will be higher than normal multilayer pcb and lead time will also be longer.
6 Drilling: L1-L3 0.15MM, L3-L6 0.15MM, L6-L8 0.15MM, L1-L8 0.2MM
7 Drilling 0.2MM holes on BGA PAD, Need to do epoxy filled in vias
8 PCB Size: 120MM*112MM/20PCS
PCB report have to include the following information:
1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;
2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;
3 Other: date code, quantity etc.
Our Product Categories:
Our Product Categories | ||
Material Kinds | Layer Counts | Treatments |
FR4 | Single Layer | HASL Lead Free |
CEM-1 | 2 Layer/Double Layer | OSP |
CEM-3 | 4 Layer | Immersion Gold/ENIG |
Aluminum Substrate | 6 Layer | Hard Gold Plating |
Iron Substrate | 8 Layer | Immersion Silver |
PTFE | 10 Layer | Immersion Tin |
PI Polymide | 12 Layer | Gold fingers |
AL2O3 Ceramic Substrate | 14 Layer | Heavy copper up to 8OZ |
Rogers, Isola high frequency materials | 16 Layer | Half plating holes |
Halogen free | 18 Layer | HDI Laser drilling |
Copper based | 20 Layer | Selective immersion gold |
| 22 Layer | immersion gold +OSP |
| 24 Layer | Resin filled in vias |
FAQ:
Q1: What is Surface Mount PCB Assembly?
A1: Surface mount in a PCB assembly means that each component on the PCB is mounted on the surface of the board. In the PCB Assembly process for surface mount components, solder paste is placed on the PCB board at areas where surface mount components will be placed on the board. PCB Stencils are usually used to apply solder paste on the PCB board and a pick and place machine is used to place SMT components on the board.
Surface Mount Assembly is very cost effective, takes up less board space and requires short production times as compared to thru-hole assembly, as it does not require the drilling of holes through the board. However, the component grip is not as good as thru-hole and also the connection can be faulty if not soldered properly.
