Send Message

Immersion Gold 8 Layer HDI PCB 1.6 MM Thickness Epoxy Resin Circuit Boards

Basic Information
Place of Origin: China
Certification: UL
Model Number: HDIPCB0010
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 15-20 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Material: FR4 Layer Count: 8 Layer
Solder Mask: Green Solder Mask Board Thickness: 1.6MM
Min Hole: 0.1MM Min Lind Space And Width: 3.5/3.5MIL
Surface Treatment: Immersion Gold 2U' Size: 120MM*112MM/20PCS
High Light:

Immersion Gold HDI PCB


8 Layer HDI PCB


Epoxy Resin Circuit Boards

Product Description

8Layer HDI PCB 1.6 MM Thickness Epoxy Filled In Vias
Main Features:
1 8 Layer HDI PCB with blind and buried holes.
2 Green solder mask and immersion gold treatment.
3 Min hole size is 0.1mm and min BGA size is 11.8mil.
4 Finished board thickness is 1.6mm.
5 The production cost will be higher than normal multilayer pcb and lead time will also be longer.
6 Drilling: L1-L3 0.15MM, L3-L6 0.15MM, L6-L8 0.15MM, L1-L8 0.2MM
7 Drilling 0.2MM holes on BGA PAD, Need to do epoxy filled in vias
8 PCB Size: 120MM*112MM/20PCS
PCB report have to include the following information:
1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;
2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;
3 Other: date code, quantity etc.
Our Product Categories:

                                            Our Product Categories

Material Kinds

Layer Counts



Single Layer

HASL Lead Free


2 Layer/Double Layer



4 Layer

Immersion Gold/ENIG

Aluminum Substrate

6 Layer

Hard Gold Plating

Iron Substrate

8 Layer

Immersion Silver


10 Layer

Immersion Tin

PI Polymide

12 Layer

Gold fingers

AL2O3 Ceramic Substrate

14 Layer

Heavy copper up to 8OZ

Rogers, Isola high frequency materials

16 Layer

Half plating holes

Halogen free

18 Layer

HDI Laser drilling

Copper based

20 Layer

Selective immersion gold


22 Layer

immersion gold +OSP


24 Layer

Resin filled in vias

Q1: What is Surface Mount PCB Assembly?
A1: Surface mount in a PCB assembly means that each component on the PCB is mounted on the surface of the board. In the PCB Assembly process for surface mount components, solder paste is placed on the PCB board at areas where surface mount components will be placed on the board. PCB Stencils are usually used to apply solder paste on the PCB board and a pick and place machine is used to place SMT components on the board.
Immersion Gold  8 Layer HDI PCB 1.6 MM Thickness Epoxy Resin Circuit Boards 0
Surface Mount Assembly is very cost effective, takes up less board space and requires short production times as compared to thru-hole assembly, as it does not require the drilling of holes through the board. However, the component grip is not as good as thru-hole and also the connection can be faulty if not soldered properly.

Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739