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4 Layer HDI PCB 0.8 MM Thickness Glass Epoxy FR4 PCB 3.5MIL

Basic Information
Place of Origin: China
Certification: UL
Model Number: HDIPCB0011
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 15-20 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Material: FR4 Layer Count: 4 Layer
Solder Mask: Green Solder Mask Board Thickness: 0.8 MM
Min Hole: 0.1MM Min Lind Space And Width: 3.5/3.5MIL
Surface Treatment: Immersion Gold 2U' Size: 97.5*91.2/54pcs
High Light:



HDI PCB 0.8 MM Thickness


Glass Epoxy FR4 PCB

Product Description

4 Layer HDI PCB 0.8 MM Thickness Epoxy Filled In Vias
Main Features:
1 4 Layer HDI PCB with blind and buried holes.
2 Green solder mask and immersion gold treatment.
3 Min hole size is 0.1mm and min BGA size is 7.1 mil.
4 Finished board thickness is 0.8 mm.
5 The production cost will be higher than normal multilayer pcb and lead time will also be longer.
6 Drilling: L1-L2 0.15MM, L1-L3 0.15MM, L1-L4 0.15MM
7 Drilling 0.2MM holes on BGA PAD, Need to do epoxy filled in vias
8 PCB Size: 97.5*91.2/54pcs

X-OUT per panel:


1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%

Our Capabilities:


NO Item Capability
1 Layer Count 1-24 Layers
2 Board Thickness 0.1mm-6.0mm
3 Finished Board Max Size 700mm*800mm
4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
5 Warp <0.7%
6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8 Drill Hole Diameter 0.1mm-6.5mm
9 Out Layer Copper Thickness 1/2OZ-8OZ
10 Inner Layer Copper Thickness 1/3OZ-6OZ
11 Aspect Ratio 10:1
12 PTH Hole Tolerance +/-3mil
13 NPTH Hole Tolerance +/-1mil
14 Copper Thickness of PTH Wall >10mil(25um)
15 Line Width And Space 2/2mil
16 Min Solder Mask Bridge 2.5mil
17 Solder Mask Alignment Tolerance +/-2mil
18 Dimension Tolerance +/-4mil
19 Max Gold Thickness 200u'(0.2mil)
20 Thermal Shock 288, 10s, 3 times
21 Impedance Control +/-10%
22 Test Capability PAD Size min 0.1mm
23 Min BGA 7mil
24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

Q1: What is Surface Mount PCB Assembly?
A1: Surface mount in a PCB assembly means that each component on the PCB is mounted on the surface of the board. In the PCB Assembly process for surface mount components, solder paste is placed on the PCB board at areas where surface mount components will be placed on the board. PCB Stencils are usually used to apply solder paste on the PCB board and a pick and place machine is used to place SMT components on the board.
4 Layer HDI PCB 0.8 MM Thickness Glass Epoxy FR4 PCB 3.5MIL 0
Surface Mount Assembly is very cost effective, takes up less board space and requires short production times as compared to thru-hole assembly, as it does not require the drilling of holes through the board. However, the component grip is not as good as thru-hole and also the connection can be faulty if not soldered properly.

Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739