|Material:||FR4||Layer Count:||6 Layer|
|Solder Mask:||Green Solder Mask||Board Thickness:||1.6 MM|
|Min Hole:||0.1MM||Impedance Control:||50 Ohm|
|Surface Treatment:||Immersion Gold 1U'||Size:||160mm*150mm/1pcs|
Green Solder HDI PCB,
Vias HDI PCB,
epoxy pcb board
6 Layer HDI PCB 1.6 MM Thickness Epoxy Filled In Vias
1 4 Layer HDI PCB with blind and buried holes.
2 Green solder mask and immersion gold treatment.
3 Min hole size is 0.1mm and min BGA size is 10 mil.
4 Finished board thickness is 0.8 mm.
5 The production cost will be higher than normal multilayer pcb and lead time will also be longer.
6 Drilling: L1-L2 0.15MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM
7 Drilling 0.2MM holes on BGA PAD, Need to do epoxy filled in vias
8 PCB Size: 160mm*150mm/1pcs
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
|1||Layer Count||1-24 Layers|
|3||Finished Board Max Size||700mm*800mm|
|4||Finished Board Thickness Tolerance||+/-10% +/-0.1(<1.0mm)|
|6||Major CCL Brand||KB/NanYa/ITEQ/ShengYi/Rogers Etc|
|7||Material Type||FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET|
|8||Drill Hole Diameter||0.1mm-6.5mm|
|9||Out Layer Copper Thickness||1/2OZ-8OZ|
|10||Inner Layer Copper Thickness||1/3OZ-6OZ|
|12||PTH Hole Tolerance||+/-3mil|
|13||NPTH Hole Tolerance||+/-1mil|
|14||Copper Thickness of PTH Wall||>10mil(25um)|
|15||Line Width And Space||2/2mil|
|16||Min Solder Mask Bridge||2.5mil|
|17||Solder Mask Alignment Tolerance||+/-2mil|
|19||Max Gold Thickness||200u'(0.2mil)|
|20||Thermal Shock||288℃, 10s, 3 times|
|22||Test Capability||PAD Size min 0.1mm|
|24||Surface Treatment||OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc|
Q1: What is Surface Mount PCB Assembly?
A1: Surface mount in a PCB assembly means that each component on the PCB is mounted on the surface of the board. In the PCB Assembly process for surface mount components, solder paste is placed on the PCB board at areas where surface mount components will be placed on the board. PCB Stencils are usually used to apply solder paste on the PCB board and a pick and place machine is used to place SMT components on the board.
Surface Mount Assembly is very cost effective, takes up less board space and requires short production times as compared to thru-hole assembly, as it does not require the drilling of holes through the board. However, the component grip is not as good as thru-hole and also the connection can be faulty if not soldered properly.