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4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: HDIPCB0013
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 25 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Layer Count: 4 Layer PCB Kind: HDI PCB
Board Thickness: 1.6MM Min Hole: 0.1MM
Copper Thickness: 1/1/1/1 OZ Surface Treatment: Immersion Gold 1U'
Material: S1150G PCB Size: 110mm*100mm/6pcs
High Light:

4 Layer HDI PCB

,

Buried Holes HDI PCB

,

TG 150 PCB


Product Description

HDI PCB 4 Layer Blind And Buried Holes 1.6 MM Thickness TG 150 Material

 

 

PCB Specifications:  

 

1 Part NO: HDIPCB0013

2 Layer Count: 4 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 Drilling: L1-L2 0.15MM, L1-L4 0.2MM

5 Min Lind Space&Width: 6/6mil

6 Copper Thickness: 1/1/1/1 OZ

7 Application Area: Consumer Products

8 File Format: Gerber File

9 PCB Size: 110mm*100mm/6pcs

10 Other Requirements: 0.2MM Holes on BGA PAD, Need to do epoxy filled in vias

 

 

 

Our production applications:

 

1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

 

 

IT180A Data Sheet:

 

 

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.8 5
8
lb/inch
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.10 %
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
4.5
4.4
--
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
0.014
0.015
--
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4 500-530
410-440
N/mm2
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched
2.4.13.1 Pass Pass Rating
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.24 45
210
2.7
ppm/˚C ppm/˚C
%
Thermal Resistance
A. T260
B. T288
2.4.24.1 >60
20
Minutes Minutes

 

 

 

 

 

Contact Details
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Phone Number : +8613826589739

WhatsApp : +008613826589739