products

Black Solder Mask HDI PCB 6 Layer FR4 Material 0.6 MM Thickness

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: HDIPCB0016
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 25 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Layer Count: 6 Layer Board Thickness: 0.6 MM
PCB Kind: HDI PCB Min Hole: 0.1MM
Impedance Control: 100 Ohm Surface Treatment: OSP
Size: 113.42mm*92.88mm/6pcs BGA Size: 12 MIL
High Light:

6 Layer HDI PCB

,

HDI PCB 0.6 MM Thickness

,

Black Solder Mask PCB


Product Description

HDI PCB 6 Layer Black Solder Mask FR4 Material 0.6 MM Thickness

 

 

PCB Specifications:  

 

1 Part NO: HDIPCB0016

2 Layer Count: 6 Layer HDI PCB

3 Finished Board Thickness: 0.6MM

4 2+N+2 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM,L1-L6 0.2MM

5 Min Lind Space&Width:3/3mil

6 Copper Thickness: 1/H/H/H/H/1

7 Application Area: Mobile Phone Charge

8 PCB Size: 113.42mm*92.88mm/6pcs

9 PCB Drawing File Size: Gerber File

 

 

 

X-OUT per panel:

 

1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%

 

 

PCB report have to include the following information:

 

1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;

2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;

3 Other: date code, quantity etc.

 

 

S1000-2 Data Sheet:

 

 

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4 DMA 185
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

 

 

 

 

Contact Details
admin

Phone Number : +8613826589739

WhatsApp : +008613826589739