|No Of Layers::||2 Layer||Board Thickness::||0.5 MM|
|Material::||RO4350B||Copper Thickness:||1/1 OZ|
|Surface Technics::||ENIG||Lead Time::||14 Days|
High Frequency Double Side PCB,
1 OZ Copper Double Side PCB,
Double Side PCB RO4350B High Frequency Material
1 2 Layer FR4 substrate material printed circuit board.
2 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated.
3 RO4350B material, pcb thickness is 0.5 mm.
Features and Benefi ts: RO4000 materials are reinforced hydrocarbon/ceramic laminates - not PTFE • Designed for performance sensitive, high volume applications Low dielectric tolerance and low loss • Excellent electrical performance • Allows applications with higher operating frequencies • Ideal for broadband applications Stable electrical properties vs. frequency • Controlled impedance transmission lines • Repeatable design of fi lters Low thermal coeffi cient of dielectric constant • Excellent dimensional stability Low Z-axis expansion • Reliable plated through holes Low in-plane expansion coeffi cient • Remains stable over an entire range of circuit processing temperatures Volume manufacturing process • RO4000 laminates can be fabricated using standard glass epoxy processes • Competitively priced CAF resistant Some Typical Applications: • Cellular Base Station Antennas and Power Amplifi ers • RF Identifi cation Tags • Automotive Radar and Sensors • LNB’s for Direct Broadcast Satellites
RO4000® hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes offered at competitive prices. The selection of laminates typically available to designers is signifi cantly reduced once operational frequencies increase to 500 MHz and above. RO4000 material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4000 series material to be used in many applications where higher operating frequencies limit the use of conventional circuit board laminates. The temperature coeffi cient of dielectric constant is among the lowest of any circuit board material (Chart 1), and the dielectric constant is stable over a broad frequency range (Chart 2). For reduced insertion loss, LoPro® foil is available (Chart 3). This makes it an ideal substrate for broadband applications. RO4000 material’s thermal coeffi cient of expansion (CTE) provides several key benefi ts to the circuit designer. The expansion coeffi cient of RO4000 material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4000 laminates provides reliable plated through-hole quality, even in severe thermal shock applications. RO4000 series material has a Tg of >280°C (536°F) so its expansion characteristics remain stable over the entire range of circuit processing temperatures. RO4000 series laminates can easily be fabricated into printed circuit boards using standard FR-4 circuit board processing techniques. Unlike PTFE based high performance materials, RO4000 series laminates do not require specialized via preparation processes such as sodium etch. This material is a rigid, thermoset laminate that is capable of being processed by automated handling systems and scrubbing equipment used for copper surface preparation. RO4003C™ laminates are currently offered in various confi gurations utilizing both 1080 and 1674 glass fabric styles, with all confi gurations meeting the same laminate electrical performance specifi cation. Specifi cally designed as a drop-in replacement for the RO4003C™ material, RO4350B™ laminates utilize RoHS compliant fl ame-retardant technology for applications requiring UL 94V-0 certifi cation. These materials conform to the requirements of IPC4103, slash sheet /10 for RO4003C, see note #1 for RO4350B slash sheet determination.
Q1: What is pcb stiffner?
A1: When working with flexible PCBs there are times when we need certain parts of the flexible printed circuit board to be rigid. We do so by adding mechanical support to parts of the PCB. This mechanical support is called a PCB Stiffener.
Flexible PCBs have many advantages like the capability to bend, twist, and fold. However, it is challenging to add/solder components and interconnects to these boards. A PCB Stiffener can be used to make a part of the board more stable/rigid so that it becomes easier to add/solder components or interconnects to the stiffer parts of the board. PCB stiffeners are usually not an integrated part of the PCB. They are only used to provide mechanical support to certain parts of the board.
Other advantages of PCB stiffeners include the reinforcing of solder joints, an increase in abrasion resistance and better handling of the board for automated pick-and-place component placement and soldering.
PCB stiffeners are usually made from FR4, Polyimide or aluminum. The thickness of FR-4 stiffeners varies from 0.003"(0.08 mm) to 0.125" (3.18 mm). The polyimide stiffeners are available with a thickness of 0.005" (125μm), 0.001" (25μm), 0.002" (50μm), and 0.003" (75μm). Polyimide stiffeners are usually a low-cost alternative to FR-4 as they are punched on a die instead of routed with a drill bit. To get better rigidity and heat sinking properties, aluminum stiffeners are used.
There are two main methods to attached PCB Stiffeners to a flexible PCB - Thermal Bonding and Pressure-Sensitive Adhesives (PSA). The properties and differences of each approach have been highlighted in the table below:
|Thermal Bonding||Pressure Sensitive Adhesives (PSA)|
|Stiffeners are attached to the flex PCB by using heat and pressure||Stiffeners are attached with the flex PCB by only using pressure|
|Stronger Bond||Bong not as strong|
|Used in bonding in IPC class 3 product (Military application, Avionics etc.)||Used in bonding in IPC class 2 product (TV, laptops, Consumer electronics etc.)|
|Higher Cost||Lower Cost|
|Will cause significant damage to the circuit while removing from flex circuit.||Usually removed without damaging circuit, if care is taken while removing.|
|Process take more time|
Process takes less time