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Enig Ultra Thin Flexible PCB Surface Finish 4 Layer Printed Circuit Board Immersion Gold

Basic Information
Place of Origin: China
Certification: UL
Model Number: PCB0029
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers:: 4 Layer Material:: FR4 TG>170
Board Thickness: 0.35 MM Solder Mask Colour:: Green
Surface Technics:: ENIG Min Lind Space&Width:: 3/3mil
High Light:

Ultra Thin Flexible PCB 4 Layer


Immersion Gold Ultra Thin Flexible PCB


enig pcb surface finish

Product Description

Ultra Thin 4 Layer Printed Circuit Board Immersion Gold Treatment



  • Main Features:


1 4 Layer Printed Circuit Board PCB .

2  Immersion Gold treatment, gold thickness 2u'.

3 FR4 substrate material, tg170 degree.

4 Min line space and width 3/3mil.

5 Copper thickness is H/H/H/H OZ

6  Green solder mask and white silkscreen.

7  ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated



  • Our Product Categories:


1  FR4 substrate PCB : 2 Layer Printed Circuit Board, 4 Layer PCB, 6 Layer PCB, 8 Layer PCB, 10 Layer PCB, 12 Layer PCB, 14 Layer PCB, 16 Layer PCB, 18 Layer PCB, 20 Layer PCB, 22 Layer PCB, 24 Layer PCB, HDI PCB, High frequency PCB.

2  Aluminum Substrate pcb: 1 Layer Aluminum PCB, 2 Layer Aluminum PCB, 4 Layer Aluminum PCB.

3 Flexible PCB: 1 Layer FPC, 2 Layer FPC, 4 Layer FPC, 6 Layer FPC

4 Rigid-Flex PCB: 2 Layer Rigid-Flex PCB, 4 Layer Rigid-Flex PCB, 6 Layer Rigid-Flex pcb, 8 Layer Rigid-Flex PCB, 10 Layer Rigid-Flex pcb

5 Ceramic substrate pcb: single Layer Ceramic pcb, 2 layer ceramic pcb



  • Our Capabilities:
NO Item Capability
1 Layer Count 1-24 Layers
2 Board Thickness 0.1mm-6.0mm
3 Finished Board Max Size 700mm*800mm
4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
5 Warp <0.7%
6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8 Drill Hole Diameter 0.1mm-6.5mm
9 Out Layer Copper Thickness 1/2OZ-8OZ
10 Inner Layer Copper Thickness 1/3OZ-6OZ
11 Aspect Ratio 10:1
12 PTH Hole Tolerance +/-3mil
13 NPTH Hole Tolerance +/-1mil
14 Copper Thickness of PTH Wall >10mil(25um)
15 Line Width And Space 2/2mil
16 Min Solder Mask Bridge 2.5mil
17 Solder Mask Alignment Tolerance +/-2mil
18 Dimension Tolerance +/-4mil
19 Max Gold Thickness 200u'(0.2mil)
20 Thermal Shock 288℃, 10s, 3 times
21 Impedance Control +/-10%
22 Test Capability PAD Size min 0.1mm
23 Min BGA 7mil
24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc



  • FAQ:


Q1: What is a 4-Layer PCB Stackup?

A1: A 4-layer PCB Stackup is a multilayer PCB that consists of multiple layers of copper and insulating materials stacked one above the other. For maximum efficiency and minimum losses and EMI, it is important to plan the right stack up of layers before starting the fabrication process. 4-layer PCB is the most common stack-up arrangement used in modern electronics.

A 4-layer PCB stack up consists of top and bottom layers, a core (copper-clad layer), and an insulating layer also called prepreg made of a dielectric material like glass fiber/weave cloth. The top and bottom layers are made of copper foils, which are then laminated and etched to create slots for mounting the components. The core layer is made up of prepreg sandwiched between two copper foils. These top and bottom layers, core layer, and prepreg are bound together in such a way that no air is trapped between them.

Enig Ultra Thin Flexible PCB Surface Finish 4 Layer Printed Circuit Board Immersion Gold 0

As mentioned in the previous paragraph, the 4-layer PCB comprises the top and bottom layers, prepreg and a core layer. Now, the top and bottom layers, made of copper foils are used as signal planes. After lamination, the desired slots are etched for the placement of components and vias, which are electroplated holes connecting different planes in the PCB. The top side of the core is used as a ground plane, while the bottom side is used as a power plane. To reduce EMI and crosstalk, it is advisable to place the ground plane above the power plane. This will help in the reduction of overlapping and interference of the magnetic fields created by the signal and the current planes. The ground plane also helps in routing the return current and dissipation of heat.


Enig Ultra Thin Flexible PCB Surface Finish 4 Layer Printed Circuit Board Immersion Gold 1






Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739