|No Of Layers::||6 Layer||Material::||FR4 TG>150|
|PCB Thickness:||2.0 MM||Solder Mask Colour::||Black|
|Surface Technics::||ENIG 1U'||Min Lind Space&Width::||3/3 Mil|
2.0 MM Thickness 6 Layer PCB,
UL 6 Layer PCB,
Black Solder Mask PCB LED Display
6 Layer PCB Display Screen Used Black Solder Mask
Printed Circuit Board Features:
1 6 Layer printed circuit board used in display screen.
2 FR4 substrate material, tg 150 degree and board thickness is 2.0mm.
3 Black solder mask and white silkscreen.
4 OSP Treatment
5 PCB size is 748mm*90.4mm/1pcs.
6 35 um copper thcikness on each layer.
7 PCB file or gerber file should be offered by customer.
8 Customized printed circuit board.
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
Q1:What is PCB Grid Testing or Bed of Nails Testing?
A1: Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains various pins inserted into an epoxy phenolic glass cloth laminated sheet (G-10) in order to access all the PCB test points. These pins act as sensors which are aligned to make contact with the test points on the PCB board and are also connected with a measuring unit through wires. The position of the pins is designed and customized for each PCB based on the components or points on the board that need to be tested.
A grid testing machine has three building blocks - a fixture, a bed of nails and software, to control the overall functionality of the machine. It usually has two cameras which are placed on the top and bottom of the machine in order to scan the whole board.
Advantages of PCB Grid Testing:
Limitations of PCB Grid Testing:
This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.