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50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: PCB0039
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers:: 8 Layer Material:: FR4 TG170
PCB Thickness: 1.2 MM Solder Mask Colour:: Black Solder Mask
Surface Technics:: OSP Copper Thickness: 1/1/1/1/1/1/1/1OZ
High Light:

50ohm Lead Free PCB

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OSP Treatment Lead Free PCB

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bga pcb assembly


Product Description

8 Layer PCB Used In Video Meeting Systems OSP Treatment

 

 

Main Features:

 

1 8 Layer Printed Circuit Board with very high relability.

2 PCB drawing size is 192.5mm*120.28mm/2pcs

3 Copper thickness is 35 um on each layer

4 FR4 substrate material , TG170 degree.

5 Surface treatment is OSP. 

6 BGA pad size 8.8mil.

7 Finished board thickness is 1.2mm.

8 Gerber file or PCB file should be offered by customer before production.

9 Differential impedance control 50ohm

 

 

S1000-2 Material Data Sheet:

 

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4 DMA 185
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

FAQ:

 

Q1:What is PCB Grid Testing or Bed of Nails Testing?

A1: Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains various pins inserted into an epoxy phenolic glass cloth laminated sheet (G-10) in order to access all the PCB test points. These pins act as sensors which are aligned to make contact with the test points on the PCB board and are also connected with a measuring unit through wires. The position of the pins is designed and customized for each PCB based on the components or points on the board that need to be tested.

50ohm 8 Layer BGA Lead Free PCB AssemblyVideo Meeting Systems OSP Treatment 0

A grid testing machine has three building blocks - a fixture, a bed of nails and software, to control the overall functionality of the machine. It usually has two cameras which are placed on the top and bottom of the machine in order to scan the whole board.

Advantages of PCB Grid Testing:

  • Very Reliable method of PCB testing as all the points on the PCB board can be tested simultaneously.
  • Offers very good accuracy since it uses two cameras
  • Can easily detect manufacturing defects
  • An in-circuit tester is easy to program
  • Interpretation of test results is quite easy
  • It checks for Open, shorts, mission components, Wrong polarity, defective components, and current leakages in the circuit
  • Most of the parameters can be checked without applying power to the PCB under test

Limitations of PCB Grid Testing:

  • Fixtures used in bed of nails testing are expensive since they are mechanical and require a different wiring assembly for a different PCB board
  • Fixtures are mechanical so any change in the number of pins or their position require extra cost
  • This test doesn’t test continuity through connectors so there are the chances that the connectors’ faults may remain unnoticed.
  • Faults related to solder joints, excess solder, solder quality, and solder void also remain unidentified

This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.

 

 

 

 

 

 

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