|No Of Layers::||8 Layer||Material::||FR4 TG170|
|PCB Thickness:||1.2 MM||Solder Mask Colour::||Black Solder Mask|
|Surface Technics::||OSP||Copper Thickness:||1/1/1/1/1/1/1/1OZ|
50ohm Lead Free PCB,
OSP Treatment Lead Free PCB,
bga pcb assembly
8 Layer PCB Used In Video Meeting Systems OSP Treatment
1 8 Layer Printed Circuit Board with very high relability.
2 PCB drawing size is 192.5mm*120.28mm/2pcs
3 Copper thickness is 35 um on each layer
4 FR4 substrate material , TG170 degree.
5 Surface treatment is OSP.
6 BGA pad size 8.8mil.
7 Finished board thickness is 1.2mm.
8 Gerber file or PCB file should be offered by customer before production.
9 Differential impedance control 50ohm
S1000-2 Material Data Sheet:
|Td||IPC-TM-650 22.214.171.124||5% wt. loss||℃||345|
|CTE (Z-axis)||IPC-TM-650 2.4.24||Before Tg||ppm/℃||45|
|Thermal Stress||IPC-TM-650 126.96.36.199||288℃, solder dip||--||100S No Delamination|
|Volume Resistivity||IPC-TM-650 188.8.131.52||After moisture resistance||MΩ.cm||2.2 x 108|
|E-24/125||MΩ.cm||4.5 x 106|
|Surface Resistivity||IPC-TM-650 184.108.40.206||After moisture resistance||MΩ||7.9 x 107|
|E-24/125||MΩ||1.7 x 106|
|Arc Resistance||IPC-TM-650 2.5.1||D-48/50+D-4/23||s||100|
|Dielectric Breakdown||IPC-TM-650 2.5.6||D-48/50+D-4/23||kV||63|
|Dissipation Constant (Dk)||IPC-TM-650 220.127.116.11||1MHz||--||4.8|
|Dissipation Factor (Df)||IPC-TM-650 18.104.22.168||1MHz||--||0.013|
|Peel Strength (1Oz HTE copper foil)||IPC-TM-650 2.4.8||A||N/mm||—|
|After thermal Stress 288℃,10s||N/mm||1.38|
|Flexural Strength||LW||IPC-TM-650 2.4.4||A||MPa||562|
|Water Absorption||IPC-TM-650 22.214.171.124||E-1/105+D-24/23||%||0.1|
Q1:What is PCB Grid Testing or Bed of Nails Testing?
A1: Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains various pins inserted into an epoxy phenolic glass cloth laminated sheet (G-10) in order to access all the PCB test points. These pins act as sensors which are aligned to make contact with the test points on the PCB board and are also connected with a measuring unit through wires. The position of the pins is designed and customized for each PCB based on the components or points on the board that need to be tested.
A grid testing machine has three building blocks - a fixture, a bed of nails and software, to control the overall functionality of the machine. It usually has two cameras which are placed on the top and bottom of the machine in order to scan the whole board.
Advantages of PCB Grid Testing:
Limitations of PCB Grid Testing:
This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.