| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | PCB00040 |
| Minimum Order Quantity: | 1 pcs/lot |
| Price: | negotiable |
| Packaging Details: | Vacuum bubble bag packaging |
| Delivery Time: | 20 days |
| Payment Terms: | T/T |
| Supply Ability: | 100k pcs/month |
| No Of Layers:: | 8 Layer | Material:: | FR4 TG180 |
|---|---|---|---|
| PCB Thickness: | 1.6 MM | Solder Mask Colour:: | Green Solder Mask |
| Surface Technics:: | Immersion Gold 3U' | Copper Thickness: | 1/1/1/1/1/1/1/1OZ |
| High Light: | Immersion Gold Industrial Control PCB,3U Industrial Control PCB,TG180 PCB |
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8 Layer PCB FR4 TG180 Material Used In Industrial Control
Main Features:
1 8 Layer Printed Circuit Board with very high relability.
2 PCB drawing size is 175.36mm*118.74mm/2pcs
3 Copper thickness is 35 um on each layer
4 FR4 substrate material , TG180 degree.
5 Surface treatment is ENIG 3U'.
6 BGA pad size 12mil.
7 Finished board thickness is 1.6mm.
8 Gerber file or PCB file should be offered by customer before production.
S1000-2 Material Data Sheet:
| S1000-2 | |||||
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 220 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 5 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 100S No Delamination | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.2 x 108 | |
| E-24/125 | MΩ.cm | 4.5 x 106 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 7.9 x 107 | |
| E-24/125 | MΩ | 1.7 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.013 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.38 | |||
| 125℃ | N/mm | 1.07 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
FAQ:
Q1:What is Flying Probe Testing?
A1: Flying Probe Testing (FPT) is a automated test used evaluate proper operation of components on a PCB board. In this test two or more probes are programmed to move across the board in the air and access various component pins one by one to detect faults like Opens, Shorts, Resistance values, Capacitance values, and Component Orientation.
These probes have high precision needles which are programmed to fly over the board and test various pins on the board.
Flying Probe Testing is usually used for prototype, low volume and small batch PCB testing. However, the process has also started to be used for high volume testing. In these cases the PCB board travels to the tester though a conveyor belt where the flying probes are programmed to test various pins on the board. The flying probes need to be programmed for each PCB board type.
Features of Flying Probe Testing:
This type of testing is called In-Circuit Testing. Another type of In-Circuit Testing is Grid Testing or Bed of Nails Testing.
