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Immersion Gold 3U FR4 TG180 Industrial Control PCB 8 Layer

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: PCB00040
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers:: 8 Layer Material:: FR4 TG180
PCB Thickness: 1.6 MM Solder Mask Colour:: Green Solder Mask
Surface Technics:: Immersion Gold 3U' Copper Thickness: 1/1/1/1/1/1/1/1OZ
High Light:

Immersion Gold Industrial Control PCB

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3U Industrial Control PCB

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TG180 PCB


Product Description

8 Layer PCB FR4 TG180 Material Used In Industrial Control

 

 

 

Main Features:

 

1 8 Layer Printed Circuit Board with very high relability.

2 PCB drawing size is 175.36mm*118.74mm/2pcs

3 Copper thickness is 35 um on each layer

4 FR4 substrate material , TG180 degree.

5 Surface treatment is ENIG 3U'. 

6  BGA pad size 12mil.

7 Finished board thickness is 1.6mm.

8 Gerber file or PCB file should be offered by customer before production.

 

 

 

S1000-2 Material Data Sheet:

 

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4 DMA 185
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

FAQ:

 

Q1:What is Flying Probe Testing?

A1: Flying Probe Testing (FPT) is a automated test used evaluate proper operation of components on a PCB board. In this test two or more probes are programmed to move across the board in the air and access various component pins one by one to detect faults like Opens, Shorts, Resistance values, Capacitance values, and Component Orientation.

These probes have high precision needles which are programmed to fly over the board and test various pins on the board.

Immersion Gold 3U FR4 TG180 Industrial Control PCB 8 Layer 0

Flying Probe Testing is usually used for prototype, low volume and small batch PCB testing. However, the process has also started to be used for high volume testing. In these cases the PCB board travels to the tester though a conveyor belt where the flying probes are programmed to test various pins on the board. The flying probes need to be programmed for each PCB board type.

Features of Flying Probe Testing:

  • FPT has fast checking speed and precision since it is software-based.
  • The probe can be moved easily from one node to another to provides better precision and accuracy for copper pad placement and solder joints.
  • Suitable for small volume production testing
  • Tests each component individually and can test LEDs as well
  • It doesn’t require test points as it uses vias embedded on the board as the test points.
  • A flying probe tester is equipped with a camera to identify missing components and to check the component polarity.
  • It is Cost-effective and can test both sides of the board
  • Since FPT is software supported, it is easier for the design engineers to take feedback in the case of any error.
  • Better access to nodes through vias, leads and SMT lands

This type of testing is called In-Circuit Testing. Another type of In-Circuit Testing is Grid Testing or Bed of Nails Testing.

 

 

 

 

 

Contact Details
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