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1.6 MM Thickness 8 Layer PCB GPS Module Blue Solder Mask ENIG SMT Circuit Board

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: PCB00041
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers:: 8 Layer Material:: FR4 TG150
PCB Thickness: 1.6 MM Solder Mask Colour:: Blue Solder Mask
Surface Technics:: ENIG 1U' Copper Thickness: 1/H/H/H/H/H/H/1 OZ
High Light:

1.6 MM Thickness 8 Layer PCB

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UL 8 Layer PCB

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ENIG SMT Circuit Board


Product Description

8 Layer PCB Used In GPS Module Blue Solder Mask ENIG

 

 

 

Main Features:

 

1 8 Layer Printed Circuit Board with very high relability.

2 PCB drawing size is 118.8mm*115mm/12pcs

3 Copper thickness is 35 um on each layer

4 FR4 substrate material ,TG150 degree.

5 Surface treatment is immersion gold. 

6 Gold thickness is 1U'.

7 Finished board thickness is 1.6mm.

8 Gerber file or PCB file should be offered by customer before production.

 

 

Our Capabilities:

 

NO Item Capability
1 Layer Count 1-24 Layers
2 Board Thickness 0.1mm-6.0mm
3 Finished Board Max Size 700mm*800mm
4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
5 Warp <0.7%
6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8 Drill Hole Diameter 0.1mm-6.5mm
9 Out Layer Copper Thickness 1/2OZ-8OZ
10 Inner Layer Copper Thickness 1/3OZ-6OZ
11 Aspect Ratio 10:1
12 PTH Hole Tolerance +/-3mil
13 NPTH Hole Tolerance +/-1mil
14 Copper Thickness of PTH Wall >10mil(25um)
15 Line Width And Space 2/2mil
16 Min Solder Mask Bridge 2.5mil
17 Solder Mask Alignment Tolerance +/-2mil
18 Dimension Tolerance +/-4mil
19 Max Gold Thickness 200u'(0.2mil)
20 Thermal Shock 288℃, 10s, 3 times
21 Impedance Control +/-10%
22 Test Capability PAD Size min 0.1mm
23 Min BGA 7mil
24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

 

 

FAQ:

 

Q1:What is PCB Grid Testing or Bed of Nails Testing?

A1: Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains various pins inserted into an epoxy phenolic glass cloth laminated sheet (G-10) in order to access all the PCB test points. These pins act as sensors which are aligned to make contact with the test points on the PCB board and are also connected with a measuring unit through wires. The position of the pins is designed and customized for each PCB based on the components or points on the board that need to be tested.

1.6 MM Thickness 8 Layer PCB GPS Module Blue Solder Mask ENIG SMT Circuit Board 0

A grid testing machine has three building blocks - a fixture, a bed of nails and software, to control the overall functionality of the machine. It usually has two cameras which are placed on the top and bottom of the machine in order to scan the whole board.

Advantages of PCB Grid Testing:

  • Very Reliable method of PCB testing as all the points on the PCB board can be tested simultaneously.
  • Offers very good accuracy since it uses two cameras
  • Can easily detect manufacturing defects
  • An in-circuit tester is easy to program
  • Interpretation of test results is quite easy
  • It checks for Open, shorts, mission components, Wrong polarity, defective components, and current leakages in the circuit
  • Most of the parameters can be checked without applying power to the PCB under test

Limitations of PCB Grid Testing:

  • Fixtures used in bed of nails testing are expensive since they are mechanical and require a different wiring assembly for a different PCB board
  • Fixtures are mechanical so any change in the number of pins or their position require extra cost
  • This test doesn’t test continuity through connectors so there are the chances that the connectors’ faults may remain unnoticed.
  • Faults related to solder joints, excess solder, solder quality, and solder void also remain unidentified

This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.

 

 

 

 

 

 

Contact Details
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Phone Number : +8613826589739

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