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0.6 MM Rigid Flex Printed Circuit Board OEM 4 Layer Camera Module PCB

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: Rigid-Flex PCB0009
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers:: 4 Layer Material:: Rigid Flex PCB
Drawing File Format: Gerber File Solder Mask Colour:: Black Solder Mask
PCB Thickness: 0.6 MM Min Lind Space&Width:: 4/4 Mil
High Light:

0.6 MM Rigid Flex Printed Circuit Board

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OEM Rigid Flex Printed Circuit Board

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4 Layer Camera Module PCB


Product Description

Rigid Flex Printed Circuit Board 4 Layer Used In Camera Module

 

 

  • Main Features:

 

1 Rigid flexible pcb, FR4 and polymide material laminated together.

2 10 Layer pcb, L1&L4 are rigid layers. L3-L2 are flexible layers.

3 Finished pcb board size is 1.2mm.

4 Copper thickness is 1/H/H/1 OZ.

5 Min hole size is 0.2mm.

6 Min line space and width is 3/3mil.

7 Surface treatment is immersion gold 1u'.

8 The production cost will be higher than normal multilayer pcb and lead time will also be longer.

9 Min BGA size is 10mil.

10 Used in camera module in mobile phones or computers. 

 

 

  • FAQ:

 

Q1:Immersion Silver (ImAg) PCB Surface Finish

A1:Immersion silver (ImAg) is a metallic coating of pure silver (0.1 to 0.4 μm), which acts as a preservative for the copper traces on a printed circuit board. It is a combination of 99% Ag metal with traces of organic material. With time, ImAg forms Sulfide Dendrites that cause a shorting problem. This problem can be avoided by applying a thin organic coat, which acts as a barrier.

An Immersion silver (ImAg) finish on a PCB is suitable for the applications that include flat surfaces like membrane switches, EMI shielding, aluminum wire bonding, and very fine traces.

Properties of Immersion Silver Surface Finish:

  • Shelf-life: 6 to 12 months
  • Offers good solderability
  • Due to its planarity (flatness), suitable for fine-pitch/BGA/Small components placement
  • Offers good solderability after exposure to various thermal cycles (more than 2)
  • Suitable for high-frequency applications

Limiting Properties of Immersion Silver Surface Finish:

  • Sensitive to handle and sensative to contaminants
  • Has a solder whiskering issue
  • Difficult for electric testing

 

Contact Details
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