Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper

Basic Information
Place of Origin: China
Certification: UL
Model Number: CeramicPCB0007
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
Place Of Origin:: Guangdong China Material:: Aluminum Nitride
No Of Layers:: 2 Layer Copper Thickness: 1/1 OZ
Surface Technics:: ENIG Board Size: 100mm*100mm
High Light:

0.4 MM Ceramic PCB Board


1 OZ Copper Ceramic PCB Board


Aluminum Nitride PCB

Product Description

AIN Ceramic PCB Board Thickness 0.4 MM 1 OZ Copper
Main Features:
1 Part NO: CeramicPCB0007
2 Layer Count: 2 Layer PCB
 3 Material Kind:  AIN Ceramic
4 Finished Board Thickness: 0.4 MM
5 Copper Thickness: 1/1 OZ
6 PCB Size: 100mm*100mm

Our Product Categories:

Our Product Categories
Material Kinds Layer Counts Treatments
FR4 Single Layer HASL Lead Free
CEM-1 2 Layer/Double Layer OSP
CEM-3 4 Layer Immersion Gold/ENIG
Aluminum Substrate 6 Layer Hard Gold Plating
Iron Substrate 8 Layer Immersion Silver
PTFE 10 Layer Immersion Tin
PI Polymide 12 Layer Gold fingers
AL2O3 Ceramic Substrate 14 Layer Heavy copper up to 8OZ
Rogers, Isola high frequency materials 16 Layer Half plating holes
Halogen free 18 Layer HDI Laser drilling
Copper based 20 Layer Selective immersion gold
  22 Layer immersion gold +OSP
  24 Layer Resin filled in vias


Q: What is HASL - Hot Air Solder Leveling?


Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper 0

HASL (Hot Air Solder Leveling) is a metallic surface finishing technique, which is performed on the outermost layer of the PCB board to protect the exposed copper surfaces like tracks until the component placement and soldering is completed.

The HASL coating is composed of Solder with 63% Tin and 37% Lead, and during the assembly process, this coating gets dissolved with the soldering material.

Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper 1

The HASL Coating is applied as per the steps below:

  1. The process starts with the immersion of the PCB board into a molten tin/lead solution, where all exposed copper area is covered by this solution.
  2. After that, a Hot Air Leveler (HAL) ensures the uniformity of solder deposit by removing the excess solder from the PCB board, using high pressure hot air knives. The purpose of this is to leave a uniform and thin possible layer on the board.
  3. This coating protects the copper traces from corrosion until the board goes in for the assembly process.


Aluminum Nitride Ceramic PCB Board 0.4 MM 1 OZ Copper 2

Advantages of HASL:

  • Resistance to copper corrosion
  • Excellent wetting capability during the soldering process
  • Provides excellent quality solder joint (solderability) by making component soldering more effective
  • Economical
  • Can be re-worked easily
  • Suitable for Lead-free PCBs
  • Reduce the chances of PCB failure

Limitations of HASL:

  • It offers high thermal stress to the PCB, which results in defects.
  • Due to the inconsistent thickness of HASL coating, it’s not a feasible solution for SMT component placement.
  • Not suitable for PTH (Plated Through Hole) components.
  • Less environment-friendly

Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739