| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | PCB000386 |
| Minimum Order Quantity: | 1pcs/lot |
| Price: | negotiable |
| Packaging Details: | Vacuum package in bubble wrap |
| Delivery Time: | 20 days |
| Payment Terms: | T/T |
| Supply Ability: | 100kpcs/Moth |
| Layer Count: | 10 Layer | Application: | Industrial Control |
|---|---|---|---|
| Solder Mask: | Green Solder Mask | Surface Treatment: | ENIG 2U' |
| Copper Thickness: | 1 OZ | TG Degree: | TG70 |
| High Light: | 1.6MM Thickness 10 Layer PCB,Green Solder Mask 10 Layer PCB,lead free hasl PCB |
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10 Layer Printed Circuit Board 1.6MM Thickness Green Solder Mask
Main Features:
1 10 Layer customized printed circuit board manufacturered based on customer's gerber files.
2 Used in Motor areas.
3 Material is FR4 S1000-2 TG170.
4 The finished board thickness is 1.6MM.
5 The finished copper thickness is 35UM.
6 Surface treatment is ENIG 2U'.
7 Drilling: L1-L10 0.2MM
8 Lead time is around 20 working days.
Material Data Sheet:
| S1000-2 | |||||
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 220 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 5 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 100S No Delamination | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.2 x 108 | |
| E-24/125 | MΩ.cm | 4.5 x 106 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 7.9 x 107 | |
| E-24/125 | MΩ | 1.7 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.013 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.38 | |||
| 125℃ | N/mm | 1.07 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
FQA:
Q1: What is HASL - Hot Air Solder Leveling?
A1:
HASL (Hot Air Solder Leveling) is a metallic surface finishing technique, which is performed on the outermost layer of the PCB board to protect the exposed copper surfaces like tracks until the component placement and soldering is completed.
The HASL coating is composed of Solder with 63% Tin and 37% Lead, and during the assembly process, this coating gets dissolved with the soldering material.
The HASL Coating is applied as per the steps below:
Advantages of HASL:
Limitations of HASL:
